A Cubic Model for the Information Sharing in the Supply Chain Planning

供應鏈規劃整合三維立體結構資訊分享模型

陳奕光(Yi-Kuang Chen) ； 劉文卿(Wen-Ching Liou)

《運籌研究集刊》 8期 (2005/12) Pp. 1-17

https://doi.org/10.7047/LRR.200512.0001

摘要

本文提出一供應鏈規劃整合的資訊分享模型，這模型是個精簡三維立體結構模型，它整合供應鏈內垂直與水平方向的參與者，也將時間軸上的不同時程規劃一起放入模式中，由於供應鏈規劃整合需要交換大量訊息，在這模型中，資訊是經由訂定的傳遞規則來做有秩序的交換及分享。同時，由供應鏈所含蓋製造步驟的多寡，此三維立體結構模型可以根據實際情況作彈性擴充。最後，利用物件導向分析粗略地展示系統架構，同時也藉由此驗證實際運用的可行性。

關鍵字

供應鏈規劃 ； 資訊分享 ； 物件導向分析

並列摘要

Based on the practical industry experiences in the semiconductor industry, we developed a concise cubic model for the supply chain planning (SCP) integration. The model not only includes vertical and horizontal partners, but also involves time phases planning integration. Since there are a lot of information that need to be exchanged for the planning integration, the information was designed to propagate through the information sharing rules. Meanwhile, the model is flexible. It could be elementary or extended based on the number of manufacturing stage in the supply chain. The high level object-oriented analysis and design was also presented in this article. The purpose is depicting the framework and showing the possibility of implementation.

並列關鍵字

Supply Chain Planning ； Information Sharing ； Object-Oriented Analysis

參考文獻

Bolstorff, R.,Rosenbaum, R(2003).Supply chain excellence: a handbook for dramatic improvement using the SCOR model.New York:AMACOM,.

Booch, G.,Rumbaugh, J.,Jacobson, I(1999).The Unified Modeling Language User Guide.Addison Wesley.

Chandrashekar, A.,Schary, P. B(1999).Toward the Virtual Supply Chain: The Covergence of IT and Organization.The International Journal of Logistics Management.10(2),27-39.

Chen, T. L.,Chang, P. L(2003).An agent-based framework for information exchange in semiconductor supply chains.International Journal of Services Technology and Managemen.4(4/6),347-364.

Childerhouse, P.,Hermiz, R.,Mason-Jones, R.,Popp, A.,Towill, D. R(2003).Information flow in automotive supply chains-present industrial practice.Industrial Management & Data Systems.103(3),137-149.