Wafer Distal Resection for Ulnar Impaction Syndrome

以Wafer末端尺骨部分切除術治療尺骨撞擊症候群

林家麟(Chia-Lin Lin) ； 張志鵬(Chih-Peng Chang) ； 陳宏明(Hung-Ming Chen) ； 曾俊雄(Chun-Hsiung Tseng)

《北市醫學雜誌》 2卷11期 (2005/11) Pp. 1071-1075

https://doi.org/10.6200/TCMJ.2005.2.11.10

摘要

尺骨撞擊症狀群通常發生在尺骨較撓骨長的手腕，但是它亦可能出現在尺骨與撓骨同長或較短的手腕中。Wafer手術是將尺骨末端部分切除，它比傳統的尺骨截短術有較少的併發症。有3位病人其尺骨較撓骨短的手腕疼痛，經保守的治療後仍無效，他們被診斷為尺骨撞擊症狀群，他們接受Wafer手術後至少18個月，其臨床的結果是優良的。

關鍵字

尺骨撞擊症候群 ； Wafer手術

並列摘要

Ulnar impaction syndrome usually happened in ulnar positive wrists, but it may occured in ulnar neutral or negative wrists. Wafer procedure is a technique of partial resection of distal ulna with less disability than usual ulna shortening procedure. There are 3 ulnar negative patients who failed in conservative treatment with the diagnosis of ulnar impaction. They received Wafer procedure with a minimum of 18 months follow up. The clinical results are excellent.

並列關鍵字

ulnar impaction syndrome ； Wafer procedure