電裝散熱模組之對流熱傳實驗研究

Experimental Study of Convective Heat Transfer in Electronic Equipment Cooling Module

王衍展(Yen-Chan Wang) ； 郭煜炘(Yu-Shin Kuo) ； 楊士震(Shie-Chen Yang) ； 曾憲中(Sheng-Chung Tzeng) ； 王紀瑞(Jee-Ray Wang)

《建國科大學報》 26卷4期 (2007/07) Pp. 1-12

摘要

本研究在探討高性能微電子裝備之熱傳及流動特性，以常見的四種類型之散熱模組進行自然對流熱傳實驗，使用壓縮空氣來進行冷卻實驗，再比較出較佳之散熱模型進行強制對流熱傳實驗，實驗條件與實際之電裝元件的運作參數範圍相同，實驗測試段經由電源供應器採用等熱通量加熱，實驗結果發現Model B（銅軸心渦輪外型散熱模組）為最佳散熱模組，最後將實驗結果建立相關之經驗公式。

關鍵字

電子裝備 ； 熱傳 ； 自然對流 ； 強制對流

並列摘要

This study discusses the heat transfer and flow characteristic of high performance electronic equipment. Four common heat sinks are investigated through natural convective experiment in the present study. The cooling fluid was pressurized air. The best model is employed into force convection experiment. To simulate the operation conditions of heat sink, the present study kept the parameters in the test rig approximately the same as those in electronic equipment. The input heat supplied to test section from the electronic power was constant heat flux. The experimental results indicate that the model B has the best performance in cooling performance. Finally, some empirical formulas are obtained from the experimental results.

並列關鍵字

Electronic equipment ； Heat transfer ； Natural convection ； Forced convection