In this study, we investigated the heat transfer capability of different commercial heat sinks for single high-performance micro electronic equipment. Six finned heat sinks, made of various configurations and materials, were selected as test specimens. There were the sheet-shaped copper fins with radiation distribution, the sheet-shaped aluminum finswith row distribution, the circular aluminum pin finswith in-line distribution, the sheet-shaped copper finswith row distribution, the sheet-shaped copper fins with radiation distribution plus heat pipe, the circular copper pin fins with in-linedistribution. The thermal performances of this six heat sinkswere measured experimentally under the free-convection and forced-convection conditions. Through the experiment, it was found that, under free-convection condition, the heat dissipation ability of the circular aluminum pin fins with in-line distributionwas the best. However, the heat transfer ability of the sheet-shaped copper finswith radiation distribution plus heat pipe was the maximum when the forced-convection condition was applied.