Jet-Impingement Effects of Alumina-Nanofluid on Aluminum and Copper

Chen, H. J. (2007). Aluminum related nanostructures: growth, characterization and applications [doctoral dissertation, National Tsing Hua University]. Airiti Library. https://doi.org/10.6843/NTHU.2007.00137
呂耿成（2009）。The peel strength of copper-bonded alumina substrates prepared by physical and chemical oxidation method〔碩士論文，大同大學〕。華藝線上圖書館。https://www.airitilibrary.com/Article/Detail?DocID=U0081-3001201315104792
王紹袁（2014）。A Study on Aluminum Pad Large Deformation during Copper Wirebonding for High Power IC Package〔碩士論文，義守大學〕。華藝線上圖書館。https://doi.org/10.6343/ISU.2014.00129
Lin, C. Y. (2014). Joining of Alumina to Aluminum and Its Interfacial Properties [master's thesis, National Taiwan University]. Airiti Library. https://doi.org/10.6342/NTU.2014.02950
蔡基琮（2009）。Preparation and properties of alumina nanowire〔碩士論文，國立虎尾科技大學〕。華藝線上圖書館。https://doi.org/10.6827/NFU.2009.00078