工廠放流廢水中汙染物質去污研究 第二報 泡沫分離法去銅氰化離子之研究

Study on the Depollution of Wastewater from Effluent Stream Part II. Removal of Cupric Cyanide Complex Ion in Wastewater from Copper Electroplating Cyanide Bath

王宏光(Hung-Kuang Wang) ； 陳彩蓮(Tsai-Liang Chen) ； 陳英茂(Ying-Mao Chen)

《化學》 68年2期 (1979/06) Pp. 37-43

https://doi.org/10.6623/chem.1979007

摘要

利用泡法分離法研究去除銅電鍍廢溶液中微量銅氰化離子的方法。研究著重三項因素，即金屬回收率，溶液保留比例及濃縮比率。從四種陽性界面活性劑中選出TDBA-CI是最適合此錯離子的去污，因此利用此界面活性劑研究最佳的分離條件。在反應比率2.14銅氰錯離子濃度範圍0.09至0.2mM，反應時間30分鐘，空氣通入速率120ml/min，pH值9.63及離子強度0.01M以下時效果為最好。應用上面條件做連續通流操作時，若停留時間超過16分鐘，則可得溶液平均保留率93.3%及金屬回收率90%以上。

並列摘要

Minor quantity of cupric cyanide complex-ion in wastewate from copper electroplating was studied with foam separation method. For evaluating the efficiencies of the decontamination and concentration, three factors such as metal recovery, ratio of solution recovery and enrichment ratios were studied. From four cationic surfactants, TDBA-Cl (Tetradecyldimethylbenzyl ammonium Chloride) was found to be most suitable, thus it was used in this study for searching the most useful conditions. Results of these are, reactant ratio of Ø=2.14, cupric cyanide complex-ion concentration ranges of 0.09-0.2 mM, time suitable for operation is 30 min, pH of 9.63 and ionic strength of less than 0.01M of NaCI solution. By using these experimental conditions, the continuous flowing experiment was carried out. Results obtained were more than 93.3% of solution recovery with 90% of metal recovery could be attained when retention time was longer than 16 minutes.