軟性基板之雷射加工應用

The Application of Laser Processing on Flexible Substrates

古淳仁 ； 林于中 ； 曾介亭

《機械工業雜誌》 407期 (2017/02) Pp. 45-55

摘要

隨著軟性電子產品追求輕薄的趨勢下，關鍵材料的軟性基板亦朝向輕薄化、可撓性發展，同時基板上建置複雜的多層材料結構，傳統機械式的切割方式，軟板基板容易受機械應力造成形變導致加工出錯或是造成撕裂，影響面板與元件整體特性，因此，軟性基板切割成型一直是業界極力克服的問題，而雷射非接觸式的加工優勢將為未來產業的發展趨勢。本文主要針對雷射關鍵技術應用於軟性多層基板製程加工進行介紹，期望建立軟性基板雷射相關應用技術，協助台灣軟性基板相關產業進行技術昇級，並提昇相關廠商之競爭力。

關鍵字

軟性電子 ； 多層結構 ； 雷射應用

並列摘要

Driven by the trend of thin and light-weight electronics, flexible electronics have become the pursuit, and the key material is thin-flexible substrate. Because the substrate will be constructed in multilayer structure, the flexible substrate is susceptible to the mechanical stress induced by the traditional mechanical cutting. Also, the deformation during the cutting will resulted in cutting error or substrate tearing, which will affect the device performance. Therefore, cutting on flexible substrate has been an issue to overcome in flexible electronic industry. We believe that the advantage of laser as a non-contact cutting tool will be the trend for future production. This article focused on laser key technology applied in flexible-multilayer substrates. We hope to build a laser technology that can be applied to flexible substrate and assist Taiwanese flexible electronics industry to upgrade its technology and to improve its competence in the world.

並列關鍵字

Flexible Electronics ； Multilayer Structure ； Laser Application