二十一世紀是高科技產品嶄露頭角的一個世代,各先進國家投入大量時間在微機電系統上,嘗試研發出適合的精密加工技術。隨著科技與工業的發展,業界需要在硬脆性材料上進行切割、鑽孔或表面微結構的加工。使用化學蝕刻方式加工具有高精度與微細化之優點,但是製程複雜且加工效率太慢;機械式加工因為具有高效率,是目前的主流加工方式。但是近幾年由於機械式加工在精度和微細化方面逐漸無法滿足產業界需求,因此業界開始嘗試雷射加工技術來取代機械加工方式。 雷射加工具有光熱加工與光化學加工兩種機制,光化學加工技術以光子直接打斷材料的化學鍵的方式移除材料,被去除的材料未歷經高溫熔解和汽化過程,加工精度和解析度勝過光熱機制加工的方式。而飛秒雷射的脈衝時間極短,具有光化學加工機制,目前國內尚未有飛秒雷射在加工方面的討論,但是國外已有加工機台的產出,表示極具發展的潛力。為了更了解飛秒雷射,本研究針對其基本加工特性進行實驗,並和業界常用的 Nd:YVO4 雷射做比較、分析,於最後提出了未來飛秒雷射在加工領域可以應用的範圍,期望能對提升國內的加工品質有所助益。
The 21st century is high-tech generation with products containing various kinds of micro-structures and micro-components. With the development of associated manufacturing technology, the industry needs, in many occasions, to carry out the processing of micro-structure on brittle materials. The use of chemistry-etching has the advantage on high accuracy, but its process is complex and has low efficiency. Now the trend is to attempt use of the laser machining to replace the conventional ways. The material removal by laser micro-machining have two kinds: photothermal and photochemical mechanisms. The processing via photochemical mechanism moves materials in a way that photons break the chemical bonds of the material directly without the high temperatures accompanied, and the machining accuracy will be much higher than that via photothermal mechanism. The femtosecond laser has a characteristic of extremely short pulse, whose working mechanism falls to photochemical category. The research on femtosecond laser applications has not been widely carried out at present, but showing great potentiality. In order to grasp its characteristics, this research was planned on the fundamental investigation and comparison was made with the Nd:YVO4 laser resualts which widely applied in industry.