小型化被動元件電鍍設備數位模擬與實際驗證

Simulation and Verification of Plating Equipment for Miniature Passive Components

林冠廷 ； 黃萌祺 ； 高端環

《機械工業雜誌》 463期 (2021/10) Pp. 22-28

摘要

未來產品將朝向小型化、薄型化等趨勢發展，被動元件之尺寸也朝向01005之超小型元件發展，由於傳統被動元件體積較大，配合適當導電體，可採用滾鍍方式進行金屬沉積，但隨著被動元件變小，傳統滾鍍製程無法將小型化被動元件有效分離，而使被動元件互相堆疊，導致電鍍金屬無法均勻沉積在端電極上，故本研究將開發高分散性超小型元件電鍍技術，藉由數位模擬進行電鍍流場設計，採用Comsol Multiphysics作為分析流場變化的模擬軟體，所建立的物理場則是選用紊流模式中的k-ε模型，採用對稱型流道設計可有效降低流場內部的渦流生成機率，獲得較好的裝置流線分佈均勻狀態並以對稱型且流道寬度16 mm的形式為主要設計。本研究之高分散性超小型元件電鍍設備可進行5000顆被動元件之測試，其電鍍不良率可降為10%以下，且電鍍金屬厚度均勻度達2.91±0.8 μm，滿足產業界對於被動元件電鍍之需求。

關鍵字

被動元件 ； 電鍍 ； 噴流式電鍍

並列摘要

Future products are developed towards miniaturization and thinning; and thus, the need for ultra-small size passive components substantially increase, in particular for the size of 01005. Due to the large production volume in traditional passive components, metal deposition of these components is carried out by barrel plating with appropriate conductive metals. As the passive components become smaller, the miniaturized passive components are unable to be dispersed effectively during traditional barrel plating process, and the components stack on each other during the process, resulting in ununiform metal plating on the terminal electrodes. Therefore, this research aims to develop a plating technology with ultra-small components being highly dispersed -- by applying Comsol Multiphysics simulation software to design and analyze the changes of the flow field. The physical field is established by the k-ε model in the turbulent flow mode. The 16 mm symmetrical flow channel design can effectively reduce vortex currents generation inside the flow field and obtain a more uniform distribution of the device streamlines. The electroplating equipment of highly-dispersive ultra-small component in this study can plate 5000 passive components with an electroplating defect ratio less than 10 %, and the uniformity of electroplated metal thickness is 2.91 ± 0.8 μm, which meets the requirements for passive components.

並列關鍵字

Passive components ； Electroplating ； Fountain electroplating

參考文獻

黃愽道，劉耀崇，中華民國專利公報公開號：I648434，小型零件的電鍍裝置，2018 年 7 月。

Lee, T. Y. Tom,Lytle, W. H.,Hileman, B.(1996).Application of a CFD tool in designing a fountain plating cell for uniform bump plating of semiconductor wafers.IEEE Transaction on Components Packaging and Manufacturing Technology-Part B.19(1),131-137.

Lee, T. Y. Tom,Lin, J. K.(2000).Design analysis of an electroless plating bath using CFD technique.IEEE Transactions on Electronics Packaging Manufacturing.23(4),306-313.

Lin, K. L.,Chang, S. Y.(1996).Approaching a uniform bump height of the electroplated solder bumps on a silicon wafer.IEEE Transactions on Components, Packaging and Manufacturing Technology-part B.19(4),747-751.