Temperature and Curing Degree Field of Composite Laminate During Bonding Repair Process

Xiaolong Zhang ； Shuxian Chen ； Dengjie Yan ； Junjie Han

《International Core Journal of Engineering》 7卷10期 (2021/10) Pp. 125-133

https://doi.org/10.6919/ICJE.202110_7(10).0021

摘要

In order to study the temperature field and curing degree field of resin matrix composite laminates with different thicknesses, a physical model of the laminates with different thicknesses was established, which included patch, adhesive layer and motherboard. The finite element model of bonding repair was established based on the 3d heat conduction theory and the curing kinetics theory of AS4/3501-6 prepreg. The temperature field, curing degree field and curing rate of the patching structure with different thicknesses were calculated. The varying processes of the temperature and curing degree with time at different points located at the middle position along the patch thickness direction, along the patch radius direction and along the adhesive layer radius were analyzed. According to the analysis, within the thickness range involved in this study, the larger the patch thickness is, the larger the peak value of heat release in the patch and adhesive layer is. The patch and adhesive layer with different thickness can be completely cured at almost the same time. The higher the thickness is, the higher the curing rate peak is, while the curing rate decreases to the minimum at almost the same time. During the curing heat releasing process, the temperature at the middle position along the patch thickness direction is higher than that of other parts, especially, when the temperature reaches the peak value.

關鍵字

Adhesively Bonded Repair ； Temperature Field ； Curing Degree ； Curing Rate

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