半導體先進3D封裝技術及產業分析研究

Semiconductor Advanced 3D Packaging Technology and Industry Analysis

吳泓均(Hung-Chun Wu)

指導教授 ： 洪一薰

國立臺灣大學/工學院/工業工程學研究所/碩士(2019年)

https://doi.org/10.6342/NTU201902380

摘要

隨著電子產業的發展，人工智能、物聯網及高效能運算等新應用，都需要半導體產業的支持應用。為達到更小的體積，節能、高效及低成本等的異質整合型晶片，當前摩爾定律（Moore's Law）已遇到瓶頸，因此，利用半導體3D堆疊封裝技術，將成為延續摩爾定律的重要關鍵。
本論文主要在說明半導體先進3D封裝技術的產業發展現況，藉由3D封裝技術及產業結構分析，對未來3D封裝市場情況提供建議。在3D封裝的技術創新初探研究中，利用先進封裝廠利用現有製程設備，研究探討可行的3D堆疊封裝結構。晶圓代工廠因應客戶的高階製程需求，開始發展封裝產業，使得晶圓代工產業與封裝產業將形成新的競合關係。
最後，藉由不同3D封裝產業面向進行分析探討找出合適的策略建議，進而推展成為最具有潛力的封裝方法，有助於未來台灣半導體3D封裝技術的發展。

關鍵字

3D封裝 ； 摩爾定律 ； 異質整合 ； 技術創新 ； 競合關係

並列摘要

With the development of the electronics industry, new applications such as artificial intelligence, Internet of Things, and high-performance computing require the support of the semiconductor industry. Moore's Law has encountered bottlenecks in order to achieve smaller, energy-efficient, efficient and low-cost heterogeneous integrated wafers. Therefore, the use of semiconductor 3D stacked packaging technology will become an important key to the continued Moore's Law.
This thesis is mainly to explain the current development of semiconductor advanced 3D packaging technology industry, through 3D packaging technology and industry analysis, to provide advice on the future 3D packaging market. In the preliminary study of 3D packaging technology innovation, the advanced packaging factory utilizes existing process equipment to study and explore the feasible 3D stacked package structure. The wafer foundries begin to develop the packaging industry in response to customers' high-level process requirements, which will enable the foundry industry and the packaging industry to form a new co-opetition relationship.
Finally, through the analysis and discussion of different 3D packaging industries, this study is to find the appropriate strategic advice, and then promoted to become the most promising packaging method, and to help the future development of Taiwan's semiconductor 3D packaging technology.

並列關鍵字

3D Packaging ； Heterogeneous Integration ； Technology Innovation ； Co-opetition Relationship

參考文獻

參考文獻

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