不同鈦含量的活性硬銲填料合金/氧化鋁基材之紅外線快速加熱動態潤濕行為研究

The study of dynamic wetting behavior of active brazes containing various Ti on Al2O3 substrate using infrared rapidly heating

黃盈翔(Ying-Hsiang Huang)

指導教授 ： 吳錫侃

共同指導教授 ： 薛人愷(R .K. Shiue)

國立臺灣大學/工學院/機械工程學研究所/碩士(2004年)

https://doi.org/10.6342/NTU.2004.00240

摘要

本實驗係利用紅外線快速加熱的特性，研究數種活性硬銲填料與Al2O3基材間之潤濕性與界面顯微組織的變化。實驗結果發現4.5Ti在氧化鋁基材上的潤濕性較1.9Ti佳，接觸角與時間的關係再現性優良，可以Ambrose公式對特性時間取適當的修正係數而達到良好之預測。界面顯微組織之觀察顯示，Ag-26.7Cu-4.5Ti(wt.%)界面處形成Ti3.3Cu2.7O界面層；而Ag-27.5Cu-1.9Ti(wt.%)則形成Ti3Cu3O與TiOx界面層，TiOx會在表面形成並阻礙填料吸收紅外線熱源的能力，故提升測試溫度無助於潤濕性的改善。本研究還針對Ti-15Cu-15Ni(wt.%)接合潤濕純度分別為95與99.5wt.%之氧化鋁基材，觀察填料中活性元素含量較高的情況下與不同純度的氧化鋁基板之間潤濕性與界面組織演化的差異，低純度氧化鋁所含雜質對潤濕性與界面組織不足以造成明顯的影響；又由於填料中Cu原子含量太少，填料熔點無法降低，故Ti-15Cu-15Ni填料與氧化鋁基材間潤濕性的表現較Ag-Cu-Ti填料差。本研究最後利用Ag-5Al(wt.%)填料潤濕純鈦與純銅基板。在純鈦基材系統中，持溫在850℃時界面為TiAl相，而持溫在900℃時界面有Ag2TiAl相存在，顯示Ag2TiAl相與900℃時潤濕性能大幅提升有關。在純銅基材中，Ag原子與Cu原子形成共晶組織使填料熔點降低，填料與基材反應激烈故潤濕性較佳。

關鍵字

Ag-Cu-Ti ； 動態潤濕性 ； 界面顯微組織 ； 活性硬銲填料 ； Ti-15Cu-15Ni ； Ag-5Al

並列摘要

Dynamic wetting angle (DWA) and interface microstructure of Ag-Cu-Ti active brazing alloys on 95wt.% Al2O3 by infrared heating were investigated and analyzed in the study. Experimental results show that Ag-26.7Cu-4.5Ti (wt.%) has better wettability than Ag-27.5Cu-1.9Ti (wt.%) and the data between wetting angle and time is reproduced quite well which can be fitted by Ambrose equation with suitable corrected characteristic time.The microstructural observations show that the interface of Ag-26.7Cu-4.5Ti/Al2O3 forms Ti3.3Cu2.7O layer﹐and that of Ag-27.5Cu-1.9Ti/ Al2O3 forms Ti3Cu3O and TiOx layers. For the latter case﹐TiOx can also form on the melt filler’s surface and block the filler to absorb infrared heat which causes the wettability of Ag-27.5Cu-1.9Ti to be independent of brazing temperature.The DWA of Ti-15Cu-15Ni(wt.%) filler alloy on 95wt.% and 99.5wt.% Al2O3 substrates were also studied.The wettability and interface microstructure are affected mostly by the filler alloy due to its high active Ti content﹐but are not so much affected by the purity of Al2O3 substrate.Because of the Cu concentration in Ti-15Cu-15Ni alloy is not high enough, the melting point of Ti-15Cu-15Ni alloy does not decrease too much.This feature causes the wettability of Ti-15Cu-15Ni/Al2O3 is inferior to that of Ag-Cu-Ti/Al2O3. In this study﹐we also used Ag-5Al (wt.%) filler alloy to wet pure Ti and pure Cu substrates. In pure Ti substrate﹐the interface is TiAl phase at 850℃ and is Ag2TiAl phase at 900℃ with the latter having the superior wettability.In pure Cu substrate,Ag and Cu atoms can react severely to form hypereutectic structure to cause its melting point decrease and thus improve its wettability.

並列關鍵字

Active brazing alloys ； Interface microstructure ； D

參考文獻

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