透過您的圖書館登入
IP:3.147.104.120
  • 學位論文

應用於印刷電路板的色彩內插法

Color Interpolation for Printed Circuit Board

指導教授 : 傅楸善
若您是本文的作者,可授權文章由華藝線上圖書館中協助推廣。

摘要


印刷電路板上的三個基本元件包括:電路板本身,銅片和錫膏;檢測的目的是將並未完整包覆銅片的錫膏區域與銅片區域快速檢測出來,而一套完整電路板影像的成像機制在檢測的過程中更是極為重要,其中包括:影像擷取、影像色彩內插、影像強化與影像縫合等四個階段來產生一張完整的電路板影像供我們做後續人工或程式的檢測工作。在這篇論文中我們將針對色彩內插這個部份提出我們的實驗方法來消除錯誤顏色的干擾,以期達到較好的影像品質,並再經由影像強化與影像縫合來重現一張完整的印刷電路板影像。

並列摘要


There are three basic components on Printed Circuit Board (PCB): the board, the copper, and the solder. Automatic optical inspection aims to segment the solder area and the copper area quickly where the solder is not totally coated on the copper. Therefore, a complete imaging mechanism is very important in inspecting process, which includes image extraction, color interpolation, image enhancement, and image stitching. After these four steps, we will have a complete image for a printed circuit board and we can do further inspection by human or program. In this thesis, we propose a new color interpolation to remove false color and improve the quality of PCB images. Then we will enhance PCB images and stitch then into a full image for further inspection.

參考文獻


[5] D. G. Lowe, “Object Recognition from Local Scale-Invariant Features,” Proceedings of International Conference on Computer Vision, Corfu, Greece, pp. 1150-1157, 1999.
[7] S. C. Pei and I. K. Tam, “Effective Color Interpolation in CCD Color Filter Arrays Using Signal Correlation,” IEEE Transactions on Consumer Electronics, Vol. 51, No. 2, pp. 560-570, 2005.
REFERENCE
[1] B. E. Bayer, “Color Imaging Array,” US Patent #3971065, 1976.
[2] T. Chen, “Bilinear Interpolation,” http://scien.stanford.edu/pages/labsite/1999/psych221/projects/99/tingchen/main.htm, 2012.

延伸閱讀