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  • 學位論文

摩擦電能量收集元件內摩擦電層表面微奈米結構之綜合研究分析

Comprehensive Analysis of Interfacial Micro-Nano Structures in Triboelectric Layer of Triboelectric Energy Harvester

指導教授 : 廖洺漢
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摘要


在本論文中利用曝光微影技術(photolithography)和乾濕蝕刻(dry and wet etching)做出金字塔凹槽陣列矽基板之後,透過對聚二甲基矽氧烷(polydimethylsioxane, PDMS)翻模,可在PDMS表面形成金字塔陣列結構,並作為摩擦電層(triboelectric layer),同時再利用磁控濺鍍沉積技術(magnetron sputtering deposition)在矽基板鍍上鉑(Pt)作為上下金屬電極,而上電極同時也作為摩擦電層,將其組裝後,製做出摩擦電能量收集元件(triboelectric energy harvester, TEH)。在PDMS摩擦電層中,製作了三種底邊長尺寸的金字塔陣列:10μm、15μm、20μm,其中底邊長為15μm的金字塔結構,其金字塔間距縮短為5μm,其餘兩種尺寸的金字塔間距則與底邊長相同。當第一種和第三種元件做量測比較,並給予相同且未達飽和的壓力(saturation pressure)時,第一種元件量到的開路電壓(open-circuit voltage)會大於第三種元件;而當金字塔底邊長15μm的間距改為5μm,並與金字塔底邊和間距皆為10μm的元件做量測比較,給予相同且未達飽和的壓力時,前者所量得的開路電壓會優於後者,因此,透過縮小金字塔間距的做法,不僅可以保有大尺寸金字塔較大的壓力感測範圍,也可以保持小尺寸金字塔較優的電壓輸出。

並列摘要


In this thesis, we made the silicon substrate with the trench pyramid array on the surface by the ways of photolithography, dry etching, and wet etching. After the replica-modeling process, pyramid array structures could be formed on the interfacial layer of PDMS, which is referred as the triboelectric layer. Also, we used magnetron sputtering deposition to deposit Pt on the silicon substrates as the metal electrodes. With the combination of the triboelectric layer and the metal electrodes, the triboelectric energy harvester is complete. On the interface of PDMS, we produced three kinds of length of side, which are 10μm、15μm、20μm, in pyramid arrays, while the spacing of the second one is shortened to 5μm. The spacing of the rest is the same as the side. After the experimental measurement, we could know that the device with smaller size of pyramid has better open-circuit voltage than that with larger size of pyramid under the same pressure, which have not reached saturation pressure yet. On the other hand, under the same pressure condition, the device with shortened spacing has better open-circuit voltage than that with smaller size of pyramid. Therefore, TEH with larger size of pyramid arrays could not only remain great range of pressure sensing but also get better performance on open-circuit voltage by changing the spacing to smaller.

參考文獻


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