透過您的圖書館登入
IP:18.226.187.24
  • 學位論文

靜電紡絲製備聚(3-己基噻吩)/聚環氧乙烷混摻纖維-銀金屬複合材料製備與形成機制探討之影響

Growth Mechanism of Silver on Electrospun Poly(3-hexylthiophene-2,5-diyl)/Poly(ethylene oxide) Nanofibers

指導教授 : 廖文彬

摘要


本論文中,我們利用靜電紡絲法來製備聚(3-己基噻吩)摻聚環氧乙烷電紡絲纖維,並利用導電高分子聚(3-己基噻吩)(P3HT)的氧化還原性質及利用四氫呋喃(Tetrahydrofuran, THF)對聚(3-己基噻吩)產生膨潤作用,使聚(3-己基噻吩)得以浮出纖維表面,形成帶狀結構,讓銀離子在表面還原成銀金屬。 我們先分別選用兩種不同性質高分子,親水性高分子聚環氧乙烷以及疏水性高分子聚乳酸,來製備混摻聚(3-己基噻吩)薄膜,探討混摻不同高分子後對其還原銀金屬結構之影響,進一步選定和純聚(3-己基噻吩)薄膜還原結果較相近之聚環氧乙烷來製備混摻纖維。無論是混摻薄膜亦或是混摻纖維,兩者皆可製備出長度達數百μm以上的帶狀銀金屬結構,此帶狀銀結構具有高度的晶體位向排列一致性,主要晶面呈現為{111}面族以及<110>的晶面成長方向,同時會形成一維帶狀結構。此外,這種長帶狀結構擁有相當大的寬高比(aspect ratio),因此未來可應用潛力極大。 簡言之,只需要利用簡易的電紡絲製程,無須額外添加還原劑或是製備特殊模版,即能在室溫環境下製備出銀金屬的一維結構。

並列摘要


In this thesis, we fabricated the conductive fiber of poly (3-hexylthiophene) (P3HT) / poly(ethylene oxide) (PEO) using the electrospinning process. On the other hand, because of the swelling effect of tetrahydrofuran(THF) on P3HT, P3HT could float up from the fiber, and reorganize the structure of P3HT simultaneously. Let silver ion reduce to silver metal on the surface and formed belt-like structure. We used two different polymers preparing different thin films, hydrophilic polymer poly(ethylene oxide) (PEO), and hydrophobic polymer polyactide(PLA), to investigate the effect of different polymers on the P3HT reducing silver metal structure. Finally, we choose PEO to prepare blending fibers of P3HT. It is because the reducing silver metal structure of the blending thin film of PEO and P3HT is similar with the P3HT thin film. Either the blending thin films or the blending fiber are easy to prepare an elongated silver structure with the range of length up to hundreds μm or more. This silver structure has high degree of consistent arrangement, shows the major crystal plane of {111}, the major growth direction of <100>, one-dimensional belt-like structure as well. The long band silver structure owns a unique large aspect ratio which its application potential of flexible panel is tremendous. In brief, we can only use the electrospinning process to prepare for one-dimensional silver structure at room temperature without adding any nucleating agent as leeding seed, or via template.

參考文獻


(1) Chiang, C. K.; Fincher, C. R.; Park, Y. W.; Heeger, A. J.; Shirakawa, H.; Louis, E. J.; Gau, S. C.; MacDiarmid, A. G. Phys. Rev. Lett. 1977, 39, 1098.
(2) MacDiarmid, A. G.; Heeger, A. J. Synth. Met. 1980, 1, 101.
(3) Bredas, J. L.; Street, G. B. Acc. Chem. Res. 1985, 18, 309.
(4) Beverina, L.; Pagani, G. A.; Sassi, M. Chem. Commun. 2014, 50, 5413.
(5) Sonmez, G.; Shen, C. K. F.; Rubin, Y.; Wudl, F. Angew. Chem. Int. Ed. 2004, 43, 1498.

延伸閱讀