多層板模型與電源完整度之最佳化分析

Modeling of Multilayer Structure and Analysis of Optimization on Power Integrity

徐巳烜(Ssu-Hsuan Hsu)

指導教授 ： 吳瑞北

國立臺灣大學/電機資訊學院/電信工程學研究所/碩士(2008年)

https://doi.org/10.6342/NTU.2008.10141

摘要

本論文主要是針對電源完整度的問題做探討。電源接地平面中，最主要的雜訊來自於信號線在穿過多層板時，引發層板間的接地彈跳雜訊。為了避免雜訊在層板間傳播導致電壓浮動、邏輯位準誤判，本論文採用了基因演算法結合三角網格電源接地平面模型，來針對實際不規則形狀的電源接地平面，完成指定位置的去耦合電容之最佳化。
本論文利用簡單的模型描述多層板的低頻特性，並探討短路連通柱對於電源完整度所造成的影響，最後針對矩形的結構提出一連通柱擺置的設計準則，以達到保持多層板電源完整度之目的。

關鍵字

電源完整度 ； 去耦合電容 ； 短路連通柱

並列摘要

The major theme of this thesis is focused on the problem of power integrity. Power integrity is a crucial issue to the stability of entire system. As noticed of the ground bounce noise for the primary noise of power-ground planes, it comes from the transition of signal current through a via which radiates the electromagnetic waves between planes. In order to avoid the voltage fluctuation, leading to misjudgment of digital signal, this thesis combines the genetic algorithm with the triangular-mesh scheme to model the power-ground planes, and thus optimizes the placement of decoupling capacitors on the specified locations for a realistically irregular-shaped geometry.
This thesis discusses the low-frequency responses of multi-layered structures using a simple model which describes the effect of shorting vias on power integrity. Finally, the design rule of the placement of shorting vias is proposed to maintain the power integrity of multi-layered structures.

並列關鍵字

Power Integrity ； Decoupling Capacitor ； Shorting Via

參考文獻

[1] International Technology Roadmap for Semiconductors. (http://www.itrs.net/)

[2] J. Choi, S. Chun, N. Na, M. Swaminathan, and L. Smith, “A Methodology for the Placement and Optimization of Decoupling Capacitors for Gigahertz Systems,” in 13th Int’l Conf. VLSI Design, pp. 156-161,January 2000.

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[5] T. L. Wu, Y. H. Lin, and S. T. Chen, “A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic band-gap structures,” IEEE Microw. Compon. Lett., vol. 14, no. 7, pp. 337-339, July 2004.

[6] C.-T. Lei, R.W. Techentin, P. R. Hayees, D. J. Schwab, and B. K. Gilbert, “Wave model solution to the ground/power plane noise problem,” IEEE Trans. Instrum. Meas., vol. 44, pp. 300–303, Apr. 1995.