超高真空系統之設計與分析

本文研究一多電子束平行寫入微影系統之超高真空(UHV)系統的設計和分析。真空腔體的內部壓力將被設計保持在1.0E-9 Torr之等級。本文提出一個低成本的超高真空系統設計，主要的零件包括真空腔體、真空幫浦、真空計等。為了在真空腔體內達到超高真空狀態，使用三種真空幫浦︰迴轉幫浦，分子渦輪幫浦、和離子幫浦。真空腔體由不鏽鋼組成，主腔體的體積大約是13公升。並且發展一套3D參數化模型程式以建立腔體結構的3D實體模型。為獲得準確預測的真空抽氣曲線，根據基本真空理論以分析真空腔體內之真空壓力與時間的關係曲線。根據原來的單腔體設計，本文也提出了雙腔體之設計，使試片在主腔體及傳送腔體之間傳送時更加方便。另外也設計晶片傳送機構，使晶片可經由傳送桿之操作，可在主腔體固定與取出。本文製作單腔體之超高真空系統初型，並量測此初型之性能。由量測結果可知此預測之抽氣曲線相當符合實驗量測之抽氣曲線；真空腔體可經由一次五天之烘烤，在七天之內達到最低之1.3E-9 Torr真空壓力。

關鍵字

超高真空系統；真空腔體；傳送腔體；真空幫浦；晶片傳送機構

並列摘要

This paper studies the design and analysis of ultra-high vacuum (UHV) systems for massively parallel maskless electron-beam direct-write lithography. The inner pressure of main vacuum chamber is designed to keep to the order of 1.0E-9 Torr. A low cost ultra-high vacuum system design is proposed, and the main components include vacuum chambers, vacuum pumps, and vacuum gauges. To achieve the UHV in the chamber, three different types of vacuum pumps are used: a rotary vane pump, a turbo molecular pump and an ion pump. The main chamber is made up of stainless steel, and its volume is about 13 litters. A parametric 3D modeling program is developed for automatically generating 3D solid model of the chamber structure. In order to get more accurate prediction of the pump down curve of the vacuum system, the vacuum pressure versus time curve for the vacuum chamber is analyzed based on basic vacuum theories. According to the initial single chamber design, a two-chamber design is also proposed for easy transfer of test samples between the main chamber and the load-lock chamber. In addition, an apparatus for transferring the wafer is designed to lock and release the wafer inside the main chamber by operation of an exchange rod. The prototype of the single UHV chamber system is manufactured and performances of the prototype are measured. From the measured results, it shows that the predicted pump down curve is quite in agreement with the measured pump down curve. The vacuum chamber can reach to the lowest vacuum pressure of 1.3E-9 Torr within 7 days by applying a 5-day baking.

並列關鍵字

ultra-high vacuum system ； vacuum chamber ； load-lock chamber ； vacuum pump ； apparatus for transferring the wafer

參考文獻

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[6] “JSM-700F Field Emission Scanning Electron Microscope,” Instructions Manual of JEOL Ltd., 2004.

[17] G. Y. Hsiung, “Ultra-High Vacuum Technique,” Colloquium in National Chiao Tung University, December 2006.

[20] M. Audi, “Ion Pumps,” CERN Accelerator School, 2006.

[22] J. R. Chen, “Vacuum System,” National Synchrotron Radiation Research Center, The 5th OCPA Accelerator School, 2008.

國際替代計量

超高真空系統之設計與分析

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