氣溶膠噴塗印刷技術於印刷電路之應用研究

現今的電子裝置中，許多裝置仍搭配蝕刻或噴墨製程之電路板(Printed Circuit Board)，這些技術雖然經過不斷的改良，仍要面對製程多限制及解析度不足的問題。本研究擬使用新類型加法製程，氣溶膠噴塗印刷( Aerosol Jet Printing )之方式，作為一電路圖形之製造方式，同時具備高度相容性與精度。針對材料與基板的相容性，印製型電路板的技術再度浮上檯面，在電子產品追求更高密度封裝的需求下，軟性、透明基板、耐高溫等眾多功能面向的新型基板與材料逐漸增加，而印製技術相較其他製程，更具有平行更換基板與即時更改材料的自由度。綜觀氣噴、噴墨( Ink-Jet Printing )兩種印製技術、與被大量使用之蝕刻製程，氣噴製程能使用之墨水材料最圍廣泛，霧化溶液的集束能力強，同時擁有靈活的應用範圍、良好的解析度、低廢棄低汙染與便於開發等優點，相比於噴墨技術解析度約高三倍，也沒有蝕刻製程中，大量的化學廢液產生與複雜的電路圖形轉移步驟，氣噴製程有著高度靈活運用的潛力。本研究針對物聯應用平台之LED模組區進行電路圖形之印製，使用氣溶膠噴印之方式，搭配奈米銀墨水作為電性溶液，透過材料改質調整墨水之配方，找出合適熱處理溫度進行燒結，進而提升電路之導電性與貼覆力，達到電性良好且穩固之電路結構，進而製作電路圖形。根據實驗之結果，氣溶膠噴印以改質過的墨水與最佳燒結的溫度，提供導入客製化電路製程之可能，驗證其氣溶膠噴印於電路圖形製作的製程性，提供出一具高解析度、低汙染性、便於開發之單道製程，為電路板之客製化電路圖形製程增加一新選擇。

關鍵字

氣溶膠塗噴印刷；電子列印；印刷電路板；奈米銀墨水；共溶劑系統；低溫燒結

並列摘要

Nowadays, the PCB boards manufactured by conventional etching or ink-jet printing process are still widely applied in many commercial electronic devices. But the low resolution and less substrate variety of the conventional PCB technology limit its advanced applications in electronics/semiconductor industry. This study intends to use Aerosol Jet Printing (AJP) to additive-manufacture the PCB board with high compatibility and accuracy. In contrast to ink-jet printing and etching process, AJP process can use the most extensive ink materials and has a flexible application range, good resolution, low waste and low pollution and easy to develop, etc. Due to the good focusing ability by sheath gas technique, AJP can reach the resolution as three times higher than the inkjet technology, and avoid a large number of chemical waste and complex circuit graphics transfer steps generated with etching process. AJP technology has strong potential in electronics prototyping and other application fields. In this study, we designed the PCB board for the LED control module suitable for the AJP method. By tuning ink/co-solvent properties and printing parameters, we successfully optimized the electricity to 14.5 times bulk silver and reliability of the printed metallic patterns.

並列關鍵字

Aerosol Jet Printing ； AJP ； electronic printing ； printed circuit boards ； nano silver ink ； co-solvent systems ； low temperature sintering

參考文獻

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[ 10 ] Eckstein, R., Hernandez-Sosa, G., Lemmer, U., & Mechau, N. (2014). Aerosol jet printed top grids for organic optoelectronic devices. Organic electronics, 15(9), 2135-2140.

[ 11 ] Tait, J. G., Witkowska, E., Hirade, M., Ke, T. H., Malinowski, P. E., Steudel, S., ... & Heremans, P. (2015). Uniform Aerosol Jet printed polymer lines with 30μm width for 140ppi resolution RGB organic light emitting diodes. Organic Electronics, 22, 40-43.

[ 12 ] Zhao, D., Liu, T., Park, J. G., Zhang, M., Chen, J. M., & Wang, B. (2012). Conductivity enhancement of aerosol-jet printed electronics by using silver nanoparticles ink with carbon nanotubes. Microelectronic Engineering, 96, 71-75.

[ 14 ] 黃致翰. (2013). 氣溶膠噴塗印刷技術應用於顯示器製程之研究. 交通大學顯示科技研究所學位論文, 1-88.

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氣溶膠噴塗印刷技術於印刷電路之應用研究

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