薄膜加熱器之均溫性實驗與模擬分析

Numerical and experimental investigations of uniform temperature distribution on polyimide film heater

劉思琪(Sih-Ci Liou)

指導教授 ： 馬小康

國立臺灣大學/工學院/機械工程學研究所/碩士(2017年)

https://doi.org/10.6342/NTU201800104

摘要

隨著科技的進步，在生活中各式各樣的電子產品皆與電熱片密不可分，需要藉由加熱來克服他們在冷啟動時的問題。電熱片在生物技術方面也應用的相當普遍，許多的醫療設備器材都需要透過電熱片增加醫療設備的穩定性及高可靠度。
為了讓電熱片有更精準的表現，電熱片加熱時之溫度均勻性為非常重要的性質之一。因此，藉由實驗與模擬分析研究Polyimide film電熱片之加熱溫度均勻性。
首先以實驗驗證電熱片擺放方式之影響，並利用熱電偶線量測分析串聯與並聯於不同電壓下之溫度穩定度。為了增加電熱片之均溫性，同時也比較了加上鋁箔之溫度分布結果。此外，建立電腦模式分析可以減少研發的時間與經費，其中包括利用COMSOL Multiphysics數值模擬軟體分析。透過模擬分析各模組在不同熱對流係數(h)下之溫度分布圖，可以明顯的看出溫度均勻性的差異，並且清楚的看出溫度不勻稱之區域。
為了能夠量化分析，本研究使用均溫性指標(Temperature uniformity index, TUI)來分析加熱表面。實驗結果顯示，串聯及並聯電熱片兩者皆在較低電壓下有較高的均溫性及穩定性，另增加鋁箔也提升電熱片之均溫性。而串聯電熱片由於電路設計密度較並聯高，因此有較佳之均溫性。串聯電熱片在熱對流係數為15(W/m^2∙K^1)與電壓為20V加鋁箔時模擬結果有最佳之TUI值0.0132。

關鍵字

電熱片 ； 數值模擬軟體 ； 均溫性 ； 均溫性指標 ； 熱對流係數

並列摘要

With the fast development of science and technology, various electronic products are related with heater, by heating to overcome the problems in the cold start. Not only that, the heater in the biotechnology is also common. Medical equipment can increase the stability and high reliability through heater. In order to make heater more accurate performance, the temperature uniformity of the heating element is one of the most important properties. Therefore, this research uses the PI film heater to study the heating temperature uniformity of the heater by experiments and simulations.
First of all, the experiment verifies the influence of the placement of the heating elements and uses the thermocouple measurement to analyze the temperature stability of the serial and parallel connections at different voltages (V). In order to increase the temperature uniformity of the heater, the temperature distribution of the heater with aluminum foil was compared. Through the simulation analysis of the module temperature distribution under different heat flux, we can clearly observe the differences in temperature uniformity, and clearly clarify the temperature uneven region.
For quantitative analysis, the study used a temperature uniformity index (TUI) to analyze heated surfaces. The experimental results show that both serial and parallel heaters have higher average temperature and stability at lower voltages, and the addition of aluminum foil to the heater increases the temperature uniformity of the heater. The serial heater due to the circuit design density higher than the parallel, so have a better temperature uniformity. The serial heater has the best TUI value of 0.0132 for simulation results at h = 15(W/m^2∙K^1) and V = 20 plus aluminum foil.

並列關鍵字

PI film heater ； Numerical simulation software ； temperature uniformity ； Temperature uniformity index ； heat transfer coefficient

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