嵌入式熱管散熱模組之實驗測試與數值分析

Experimental and Numerical Investigations of Thermal Performance in Heat Sink with Embedded Heat Pipes

周文豪(Mun-Ho Chow)

指導教授 ： 陳希立

國立臺灣大學/工學院/機械工程學研究所/碩士(2005年)

https://doi.org/10.6342/NTU.2005.00945

摘要

隨著電腦性能不斷的提升，中央處理器、顯示晶片及其它晶片組的運作時脈提高，伴隨產生的熱量卻因為方便性及潮流，機殼設計比以前更輕巧縮小，使得系統散熱條件變得更嚴苛。本研究之主要目的在使用Icepak熱傳分析軟體對嵌入式熱管散熱模組進行模擬分析，目標在達到理想的發熱源溫度。首先，進行實驗以驗證Icepak熱傳分析軟體的準確性。實驗與數值模擬之發熱源溫度最大誤差為2.78%、總熱阻最大誤差為2.71%。故得到之實驗與數值模擬之趨勢及結果相當符合，驗證了Icepak在熱分析上之準確性。
　　分析結果顯示，考慮熱管冷凝端水平之間距，其間距為61.32mm時，其散熱性能最好。另外，熱管冷凝端與散熱鰭片底部距離為26mm時，其散熱性能最好。就熱管蒸發端而言，熱管蒸發端間距為8mm時，，其散熱性能最好。增加熱管數量亦能有效的降低發熱源溫度及總熱阻，與Type B散熱模組相比，其總熱阻最大可降低約10.69%。

關鍵字

熱管 ； 數值模擬

並列摘要

With the computer function continuously enhanced, the frequency of CPU, VGA chips and the other chips set are also raised. However, the hot condition becomes more rigorous because the design of machine hull is more agile than past to follow the convenience and trend. The main purpose of this research is to adopt the Icepak to carry on the simulation and the analysis to the heat pipe-fin modules. The target is to reach the ideal CPU temperature. First, we have an experiment to identify the accuracy of Icepak. The temperature’s maximum error between CPU of simulation and the experiment is 2.78% and the maximum error margin of thermal resistance is about 2.71%. The trend of simulation is consistent with the result of the experiment, which proofs Icepak in the accuracy of the thermal analysis.
According to the analysis of the result, it shows that when considering the vertical interval in heat pipe condenser section is 61.32mm, the thermal performance is better. Besides, as the heat pipe condenser section is 26mm, its thermal performance is better to the others. As for the evaporator section, while the interval in evaporator section is 8mm, the better the thermal performance. Increasing the number of heat pipes also can reduce the temperature of CPU and the thermal resistance. Compared with Type B module, its total thermal resistance can at least reduce about 10.69%.

並列關鍵字

Heat Pipe ； Icepak ； CFD

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