中文摘要 本文研究目的在於利用ICEPAK數值模擬分析軟體進行高功率LED燈模組的分析研究。LED燈為九個小晶片以3×3排列方式所組成的高功率LED燈,搭配一鋁散熱基板,基底為鋁材質的散熱鰭片,並規畫相關實驗流程進行實驗模組之測試,進而分析模組參數設計與結果分析。 研究結果顯示分析結果與實驗值誤差在4.7 %之內,在晶片之間的距離(D)增加後發現溫度有降低的情形,發熱量1.5 W ~ 7.5 W晶片之間的最佳距離(D)為1.8 mm,該距離下溫度有最大降幅,而在散熱基板熱傳導係數的改變下發現,當散熱基板熱傳導係數(K)提升至300 ( )時溫度有最大降幅降低1 ℃~ 2 ℃,最後在不同晶片排列形狀比較下發現,輻射排列(A2)型與H排列(B3)型的排列方式晶片最高溫度都低於方型排列最佳距離之溫度,甚至可降到散熱基板熱傳導係數(K)為400 ( )時的溫度,其中又以A2型晶片溫度最低,為最佳的排列形狀。本文分析之結果可供作為往後改良之參考依據。
ABSTRACT A numerical research using the Computational Fluid Dynamics (CFD) software, ICEPAK, was performed to investigate a high-power Light-Emitting Diodes (LED) module. The LED module was composed of nine diodes, arranged in a 3×3 matrix configuration, and was pasted on an aluminum (Al) substrate, which was set on an aluminum heat sink. In addition, an experimental work was carried out to examine the thermo-fluid phenomenon of the module, and the measurement was compared with the simulation result to ensure the parameters used in the ICEPAK . The results showed that the error range between measurement and simulation was within 4.7%. Also, the simulation indicated that the temperature decreases when the diode distance (D) increases. The optimum diode distance (D), shows a biggest range of temperature decrease, is 1.8 mm with LED’s heat capacity ranging from 1.5 to 7.5 W. By increasing the thermal conductivity of the base plate to 300 , the temperature has biggest decreasing range, which is within 1 ℃ to 2 ℃. Finally, the analysis showed that the maximum temperature of the 9 diodes, which were arranged in radial configuration (A2) or H configuration (B3), was lower than the temperature of the 3 by 3 matrix configuration with optimum diode distance. This maximum temperature was even lower down to the temperature of the 3 by 3 matrix configuration with the base plate’s thermal conductivity equals to 400 . Due to the lowest temperature obtained among six configurations, the A2 pattern is recognized as the best configuration. The results can be used as a guiding reference for the commercial design of the LED lamp.