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  • 學位論文

電子封裝掉落衝擊測試之量化可靠度評估

quantitative reliability analysis of drop impact testing for electronic packages

指導教授 : 吳文方

摘要


封裝體尺寸的變異性和衝擊壽命預估模型中參數的變異性會導致電子封裝掉落衝擊測試得到的衝擊壽命亦具有變異性,本研究以可靠度的觀點探討此二項可能對衝擊壽命預估造成影響的重要因素。首先利用有限元素軟體,模擬電子封裝在受到尺寸變異性因素影響之下的掉落衝擊測試過程與結果,再利用參數固定的衝擊壽命預估模型求其衝擊壽命分佈;接下來討論當衝擊壽命預估模型參數的變異性存在,而尺寸變異性不存在時,封裝體的衝擊壽命分佈情形;最後同時考慮尺寸變異性及壽命預估模型參數變異性,以觀察與比較預估模型中各參數的變異性與尺寸變異性同時存在時,對電子封裝衝擊壽命分佈的影響。藉由分析並觀察上述各項因素造成之封裝體掉落衝擊壽命的分佈情形,可探討並比較此些變異性因素單獨或同時存在時對封裝體衝擊壽命之變異性以及可靠度表現的影響。研究結果發現,當預估模型中參數不具足夠小的變異性時,其對封裝體衝擊壽命的變異性和可靠度之影響相對於尺寸變異性的影響為不可忽略,且當參數變異性與尺寸變異性同時存在時,封裝體衝擊壽命之變異性和可靠度相較於僅有尺寸變異性存在時分別有擴大和下降的趨勢。就此,本論文的分析過程及結果應可做為電子封裝掉落衝擊測試分析及可靠度評估之參考。

並列摘要


From reliability engineering point of view, present study investigates the effect of solder ball size and parametical values of life prediction model on the impact life of electronic packages. First, finite element analysis is employed to find the maximum stress of an electronic package subjected to a JEDEC prescribed acceleration input. The input is resembled to what will really happen in a drop test. The drop impact life of the package is then evaluated based on an empirical formula that relates the calculated stress to the life. The effect of probability variation of solder ball size on the impact life of the package as well as its reliability is discussed in particular. In the second phase of the study, the parametrical values used in the drop life prediction model are discussed in detail, also from probability point of view. Through considering their probability variations, the predicted impact lives also appear in a probabilistic manner which, in turn, reflects the quantitative reliabilities of the package. It is found that all factors studied in this thesis affect the impact life of the package and its reliability to certain degrees. Among them, the influence of model parameters may be the greatest if their variations are large enough.

參考文獻


[55] 林有玉,電子構裝之力學分析與量化可靠度評估,國立台灣大學機械工程學研究所碩士論文,2005。
[1] C. Zhou, P. C. Nelson, W. Xiao, T. M. Tirpak and S.A. Lane, “An intelligent data mining system for drop test analysis of electronic products,” IEEE Transactions on Electronics Packaging Manufacturing, Vol. 24, pp. 222-231, 2001.
[2] C. T. Lim, Y. M. Teo and V. P. W. Shim, “Numerical simulation of the drop impact response of a portable electronic product,” IEEE Transactions on Components and Packaging Technologies, Vol. 25, pp. 478-485, 2002.
[7] E. Suhir, “Could shock tests adequately replace drop tests?” Proceedings of the 8th Advanced Packaging Materials, pp. 67-81, Atlanta, GA, USA, 2002.
[9] Y. C. Ong, V. P. W. Shim, T. C. Chai and C. T. Lim, “Comparison of mechanical response of PCBs subjected to product-level and board-level drop impact tests,” Proceedings of the 5th Electronics Packaging Technology Conference, pp. 223-227, Singapore, 2003.

被引用紀錄


黃郁淳(2009)。衝擊測試下餘震對電子構裝元件可靠度之影響研究〔碩士論文,元智大學〕。華藝線上圖書館。https://www.airitilibrary.com/Article/Detail?DocID=U0009-2707200901343400

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