鎊線轉接之高頻補償及設計

本論文提出一系列的改良，藉以提昇鎊線轉接的電氣特性。首先，為了瞭解鎊線轉接的特性，我們先萃取其等效電路；由等效電路我們得知，傳統的鎊線轉接為電感性。接著，我們提出了一個共振的架構，藉由控制適當地控制共振頻率點的位置來和原有頻寬結合，藉此來製造更大的頻寬。在本文中，以共振頻率40GHz而言，反射損耗在13dB以下的頻寬為37%。穿透損耗亦在0.8dB以上。另一個架構為低阻抗傳輸線補償，然而該架構只能降低原頻寬內的反射損耗而無法增加額外的頻寬。剩下的一種則是多段傳輸線串接補償，本文中以最簡單的兩段傳輸線為例。可以看到從直流到60GHz的反射損耗都在15dB以下。雖然上述的設計理念滿不錯的，但是這種設計方式會損耗晶片在傳播方向的面積，且上述三種方式僅是治標而非治本的方式。真正治本的方式是做好阻抗匹配的工作，讓輸入等效阻抗值接近於系統阻抗。在此，增加鎊線接點附近的傳輸線寬度來增加電容值，以補償轉接的電感效應，因而改善轉接的效能。我們定義頻寬為反射損耗低於20dB的區域。基本上文中所提到的四個架構中，每個補償後的架構皆有增加40%以上。在此證明該種補償方式相當地簡單亦實用。接著，結合兩大類補償的優點。在平行補償後的架構中，藉由犧牲一部分的反射損耗來增加額外的頻寬。第五章的砷化鎵到氧化鋁基板的例子中，頻寬從原先未補償前的16GHz到補償之後的47GHz，將近有200%的改善。而在降頻的同介質轉同介質的實驗之中，補償後額外增加的頻寬亦有50%，這點和同介質轉接的模擬相吻合。

關鍵字

鎊線；補償

並列摘要

To improve the electrical performance of the bonding-wire transition, a step by step procedure is proposed in this thesis. To begin with, the equivalent circuit of the transition is extracted from the full-wave simulation result by HFFS, which shows an overall inductive effect. Then, a matching circuit which resembles a resonant phenomenon is proposed to achieve minimum reflection in the desired frequency band by simply changing the length and width of the additional transmission line. The extra relative bandwidth, when insertion loss is lower than -13dB, is 37% when the resonant frequency is set to be 40GHz. Another is low impedance line compensation. It doesn’t increase the bandwidth but let the return loss better in low frequency bands. The other is multi-line compensation, this one have the broadest bandwidth, says -15db, from DC to 60GHz in this chapter. But it is hard and complex to design. In order to have a wider bandwidth and better response, it needs some essential compensation. In chapter 4, it tries to enlarge the capacitances locally. For example, the return loss is set to be -20dB and the bandwidth are as large as possible. Structures which are list in chpater4 all have improvement of additional relative bandwidth at least 40%. This result means that the compensation is useful and easy to design. Then, add a short transmission line, the return loss the tradeoff for bandwidth. The example in chapter5, its bandwidth is 47GHz after compensation for an excess relative bandwidth of 200%.The experiment in chapter5 also has an additional bandwidth about 50%. This is reasonable since both the substrate1 and 2 are the same material and the discontinuity is already small before compensation.

並列關鍵字

bonding-wire ； compensation

參考文獻

[1] F. Alimenti, P. Mezzanotte, L. Roselli, and R. Sorrentino, ‘‘Modeling and characterization of the bonding-wire interconnection,’’ IEEE Tran. Microwave Theory Tech., vol. 49, no.1, pp. 142-150, Jan.2001.

[2] Jin-Yang Kim, Hai-Young Lee, Jae-Hyun Lee, and Dong-pil Chang, ‘’Wideband characterization of multiple bondwires for millimeter-wave applications,’’ in IEEE Asia-Pacific Microwave Conf., Sydney, NSW, Australia Dec. 2000, pp. 1265-1268.

[3] T. P. Budka, ‘’Wide-bandwidth millimeter-wave bond-wire interconnects,’’ IEEE Trans. Microwave Theory Tech., vol. 49, no. 4, pp. 715-718, April 2001.

[4] U. Goebel, ‘’DC to 100GHz chip-to-chip interconnects with reduced tolerance sensitivity by adaptive wirebonding,’’ in IEEE 3rd Topical Meeting on Electrical Performance of Electronic Packaging, Monterey, CA, USA, Nov. 1994, pp. 182-185.

[5] C. T. Tsai, “Package inductance characterization at high frequencies,” IEEE Trans. Advanced Packaging, vol. 17, no. 2, pp. 175-181, May 1994.

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鎊線轉接之高頻補償及設計

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