微結構在三維積體電路及太陽能電池之電磁與半導體特性模擬

使用銅矽通孔（TSV）技術，三維晶片積體電路封裝(3D-IC)的襯底耦合(substrate coupling)是一個被廣泛記載在最近文獻的處理困境。且討論仍僅限於電磁理論框架，使得噪聲傳播和吸收的一個完整的理解受到阻礙。第三章深入考察了銅矽通孔的這些現象，且從半導體物理和電磁理論的綜合觀點和調查來深入探討，採用p +保護環(p+ guard-ring)及接地銅矽通孔(grounded TSV)的組合且透過三維元件模擬來深入探討降低噪聲的方法。使用閃耀光柵在薄膜單晶矽太陽能電池可望用光微影術(Optical Lithography)及離子束蝕刻(ion-beam etching)來達成，是一種前途看好的低成本及高效率太陽能電池的應用。我們執行極化相關的二維數值模擬基於嚴格耦合波分析法(rigorous coupled wave analysis - RCWA)及有限元素法來達到太陽能結構光吸收的最佳化。在電性方面，背表面場層(BSF)是由重摻雜受體來形成，建立了一個濃度梯度，且此層是放在閃耀光柵上面來提供一個額外小的漂移電場來幫助收集少數載子電子。整合最佳化抗反射層(optimized antireflection coating)及背表面場層(BSF)和閃耀光柵在2 μm厚的太陽能電池可使效率(cell efficiency)成長兩倍。光學設計在提高III族氮化物(group-III-nitride)和多層量子井超晶格(superlattice)為主的氮化銦鎵/矽(InxGa1-XN/cSi)雙結疊層發光太陽能電池(light emitting solar cell)且具有三角形衍射光柵(triangular diffraction grating)的光吸收模擬和優化通過使用組合的二維嚴格耦合波分析和轉移矩陣的方法(combined two-dimensional rigorous coupled wave analysis and transfer matrix methods)。此元件在順偏下亦可為發光二極體。本文徹底檢查光吸收受抗反射塗層，多個薄膜層及三角形衍射光柵的影響透過半導體物理和電磁理論結合的綜合觀點來討論這些現象。相比於原型雙結疊層發光太陽能電池獲得有58％的光吸收的改進，這意味著80％以上的入射光（hυ > EgSi）可在該薄膜設計（共小於 < 4微米）被吸收而轉換為電能。

關鍵字

三維積體電路；銅矽通孔；太陽能電池；閃耀光柵；背表面場層；電磁特性；半導體特性；模擬；微結構；氮化銦鎵；矽；抗反射層

並列摘要

Substrate coupling in 3D-ICs using Cu through silicon vias (TSVs) is a predicament widely documented in recent literature. Yet discussions remain limited to the electromagnetic framework, such that a complete understanding of noise propagation and absorption is hampered. Chapter 2 thoroughly examines these phenomena in TSVs from the integrated perspectives of semiconductor physics and EM Theory and investigates the noise reduction method using the combination of p+ guard-ring and grounded TSV via 3D device simulation. Both 2D electromagnetic and electrical semiconductor simulations are performed sequentially in this study in order to better understand the structural principles of thin-film crystalline solar cells with back surface field and blaze diffractive grating. In the absence of adequate approximations for blazed gratings, we simulate silicon solar cells electromagnetically and electrically in order to deal with the geometrical complexity produced by the blazed grating with a BSF on top of it. Thin-film crystalline silicon solar cells (TF-c-Si SCs) typically exhibit poor quantum efficiency both at shorter wavelengths and longer wavelengths with sharp drops in spectral response. Longer wavelength spectral response (from 0.6 μm to 1.2 μm) is addressed here first by considering the influence of blaze gratings on the enhancement of effective optical absorption in thin-film crystalline silicon (TF-c-Si) solar cells. The effect of the back surface field layer (BSF) in terms of improving minority carrier collection is also taken into account. In the 2D electromagnetic simulation, polarization dependent two-dimensional (2D) numerical simulations based on rigorous coupled wave analysis (RCWA) and finite element method (FEM) are implemented for the optimization of optical absorption of the solar cell structure. A rather large tolerance in design parameters of the optimized blaze grating structure was found. The optimized blaze grating structures help in improving the cell efficiency, especially for weak absorption thin cell structures. The enhancement of equivalent optical path length reveals the efficient light trapping effect caused by the diffractions of the blaze grating structures, especially in the longer wavelength range. In the electrical semiconductor simulation, the BSF, which arises from the heavy acceptor doping that creates the concentration gradient, is set atop the blaze grating in order to provide an extra small drift field for the collection of minority electrons. Incorporating the optimized antireflection coating along with a BSF layer and a blaze-grating in the 2 μm cell doubles cell efficiency. The use of blazed gratings in thin-film solar cells, which can be performed upon silicon by means of lithography and ion-beam etching, is promising for low cost and high-efficient solar cell applications. Optical design in enhancing optical absorption of group-III-nitride- and multiple quantum well-based GaN/InxGa1-xN/cSi dual-junction tandem solar cells with triangular diffraction grating is simulated and optimized by using combined two-dimensional rigorous coupled wave analysis and transfer matrix methods. This work thoroughly examines these phenomena of optical absorption affected by antireflection coatings, multiple thin-film layers and diffraction gratings with the integrated perspectives of semiconductor physics and electromagnetic theory for the first time. An improvement of 58% in absorption compared to the prototype SC is obtained which means more than 80 % of incoming light (hυ > EgSi) can be harvested in this thin-film (< 4 μm in total) design.

並列關鍵字

Three-Dimensional Integrated Circuits ； Cu Through Silicon Vias (TSVs) ； Photovoltaics ； Blaze Gratings ； Back Surface Field (BSF) ； Electromagnetic Characteristics ； Semiconductor Characteristics ； Simulation ； Microstructures ； Gallium Indium Nitride ； Silicon ； Anti-Reflection Coating (ARC)

參考文獻

[1] P. Garrow, C. Bower, and P. Ramm, Handbook of 3D Integration. Hoboken, NJ: Wiley, 2008.

[2] S. Ramaswami, J. Dukovic, B. Eaton, S. Pamarthy, A. Bhatnagar, Z. Cao, K. Sapre, Y. Wang, and A. Kumar, “Process integration considerations for 300 mm TSV manufacturing,” IEEE Trans. Device Mater. Rel.,vol.9,no. 4, pp. 524–528, Dec. 2009.

[3] T. Bandyopadhyay, R. Chatterjee, D. Chung, M. Swaminathan, and R. Tummala, “Electrical modeling of through silicon and package via,” in Proc. IEEE 3DIC, 2009, pp. 1–8.

[5] D. K. Su, M. J. Loinaz, S. Masui, and B. A. Wooley, “Experimental results and modeling techniques for substrate noise in mixed-signal integrated circuits,” IEEE J. Solid-State Circuits., vol. 28, pp. 420–430, Apr. 1993.

[6] Lin, L.J.-H., Hsiao-Pu Chang, Tzong-Lin Wu, Yih-Peng Chiou, " 3D simulation of substrate noise coupling from Through Silicon Via (TSV) and noise isolation methods," IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2012.

國際替代計量

微結構在三維積體電路及太陽能電池之電磁與半導體特性模擬

全文下載

主題瀏覽