以噴墨列印方法製作金屬化導線研究

The study of metallization by ink jet printing

林子涵(TZ -HAN LIN)

指導教授 ： 顏溪成

國立臺灣大學/工學院/化學工程學研究所/碩士(2008年)

https://doi.org/10.6342/NTU.2008.03112

摘要

奈米粒子的大小影響著觸媒和電子元件的特性，因此各種製備不同大小奈米粒子的可靠方法，一直持續被開發。噴墨列印金屬化製程提供了一種無需光罩的製程，相較於傳統的技術，直接噴墨列印能夠減少成本和降低製程的複雜性。本實驗期望利用電化學合成法，製備不同粒徑的奈米銀，並將製備的奈米銀配合發展成熟之無電電鍍技術，以噴墨列印方式在低溫之下直接形成銀導線。
首先探討過電位大小對奈米粒銀粒徑的影響，接著探討在室溫之下，不同的合成方法對反應速率的影響。電化學合成奈米銀系統中，在氫氣還原電位之前，過電位越大奈米粒徑越小，最小粒徑可控制在5.4 nm。電化學合成系統中的反應速率也遠快於氧化還原法，反應時間在第120分鐘時，電化學合成系統的濃度為氧化還原的1.5倍：若以電化學法配合氧化還原法，反應時間在第120分鐘時，濃度為單純氧化還原法的4.5倍。以自行製備的奈米銀溶液作為金屬化導線的墨水，重複噴列十次以上可以得到連續的導線，銀導線經過兩次無電鍍銀之後，厚度約為1000 nm，最小的電阻率為19.6 μΩ•cm。

關鍵字

奈米銀 ； 噴墨列印 ； 無電鍍

並列摘要

Particle size strongly influences the catalytic and electronic properties of materials, therefore the development of reliable methods for the nano-size preparation has been in progress. Metallization by ink-jet printing offers a maskless alternative method to conventional process. Direct ink jet printing can provide low cost, and reduction in process complexity. In this study, we try to synthesize nanosilver particles by electrochemical methods and then ink-jet printing, combined with nanosilver preparation and electroless plating, has been developed and directly writes silver lines at low temperature.
First of all, we have investigated the effect of overpotential in electrodepostion on the particle size, and the effects of electrodeposition on reaction rate in various reaction conditions. In the electrolytic system, the larger overpotential we applied, the smaller particle size we acquired as long as the overpotential is not beyond the potential of reduction of hydrogen. The smallest particle size obtained is 5.4 nm. The production rate of nanosilver particles by electrochemical method has also been found much faster than chemical reduction. The concentration of nanosilver particles by electrodeposition with chemical reduction is four and half times of that by chemical reduction. After ten times of printing we could acquire continuous lines by the formulated nanosilver ink. The silver lines which is thickened by silver electroless plating tiwce is about one thousand nanometers and its resistivity is 19.6 μΩ•cm.

並列關鍵字

nanoAg ； ink-jet printing ； electroless plating

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