含有活性酯之聚醯亞胺、聚碳酸酯與環氧樹脂固化之製備與性質探討

Preparation and Properties of Polyimides and Polycarbonates Containing Active Ester Groups Curing with Epoxy Resin

陳建任(Jian-Ren Chan)

指導教授 ： 林慶炫

國立中興大學/工學院/化學工程學系所/碩士(2018年)

摘要

本論文以主鏈具有活性酯基之聚醯亞胺與環氧樹脂進行固化以及具有碳酸酯之聚碳酸酯與環氧樹脂進行固化，並由FTIR、DSC圖譜中判斷該反應確實成功進行。
(1)比較熱性質環氧樹酯與聚醯亞胺固化後Tg為220~250 ℃之間。相較於常見固化劑DDS1所形成的固化物，使用聚醯亞胺當固化劑形成固化物顯示更良好之熱性質，且聚醯亞胺與環氧樹脂僅有一個Tg代表相容性佳。
提升疏水性質與介電性質則在結構中導入活性酯進行酯交換反應，可以避免二級醇之產生進而降低其極性。再導入含氟之結構可以提高疏水性並降低介電常數達到2.77U以及得到接觸角為83.15°。拉力性質在環氧樹脂固化後因高度交聯而提升其機械強度。
(2)聚碳酸酯部分，由檢測之Tg得到聚碳酸酯與環氧樹脂固化可得到相容性佳之材料，而使用此方法(將聚碳酸酯當成固化劑)可以解決當下聚碳酸酯回收之問題，不用透過降解等方式即可以使用在材料中，在未來可以進行此方向之研究測試。

關鍵字

環氧樹脂 ； 聚醯亞胺 ； 聚碳酸酯 ； 活性酯 ； 固化劑

並列摘要

In this paper, the polyimide with an active ester group in the main chain is cured with an epoxy resin, and the polycarbonate which containing carbonate group is cured with epoxy resin. The reaction is judged to be successful by FTIR and DSC.
(1) The thermal properties of the epoxy resin and polyimide after curing are between 220 and 250 °C. Compared with the cured product formed by the common curing agent DDS1, the use of polyimide as a curing agent to form a cured product shows better thermal properties, and the polyimide cured with the epoxy resin have only one Tg and it is means good compatibility.
Enhancing hydrophobic properties and dielectric properties, the active ester is introduced into the structure for transesterification, which can avoid the generation of secondary alcohol and thus reduce its polarity. Further introduction of the fluorine-containing structure can increase the hydrophobicity and lower the dielectric constant to 2.77 U and the contact angle is 83.15 °. The tensile properties increase the mechanical strength of the epoxy resin due to its high degree of crosslinking.
(2) In the polycarbonate part, it is presumed that the polycarbonate and the epoxy resin are cured to be excellent compatibility materials by the Tg obtained, and the use of this method (using polycarbonate as a curing agent) can solve the current polycarbonate recovery. The problem can be used in materials without degradation, etc., and research report in this direction can be carried out in the future.

並列關鍵字

epoxy ； polyimide ； polycarbonate ； active ester ； curing agent

參考文獻

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