非導電流體之兩相噴擊冷卻實驗研究

An Experimental Study of Two Phase Multiple Jet Cooling Using a Dielectric Fluid

張秦耀(Chin-Yao Chang)

指導教授 ： 簡良翰

國立臺北科技大學/機電學院/能源與冷凍空調工程系碩士班/碩士(2009年)

https://doi.org/10.6841/NTUT.2009.00110

摘要

近年來科技的進步，使得運算晶片密集度越來越高，並產生大量的熱能，因此需要一高效率的散熱系統。本研究以非導電流體FC-72做為工作流體，探討噴擊冷卻之晶片散熱性能。實驗之散熱器系統溫度設為50℃，滴淋分配盤有五個或九個0.24 mm的滴淋孔，距離測試表面5 mm，加熱面積12×12 mm2。測試表面有光滑表面，鰭片高、寬與鰭片間距均為400μm的針狀與槽道表面，鰭片高800μm、鰭片寬與鰭片間距均為200μm的針狀與槽道表面。滴淋方向分為垂直滴淋與側邊滴淋，流量為50 ~ 100 ml/min。實驗結果得知增加流量可提升熱傳性能，垂直滴淋的性能較側邊滴淋高，而利用鰭片增加散熱表面積也有顯著效果。各表面中以鰭片高800μm、鰭片寬與鰭片間距均為200μm的針狀表面之性能最佳，在流量為150 ml/min時較光滑表面增加約250 %。此針狀表面在本研究之滴淋散熱器以150 ml/min流量運作時，加熱量8.91 ~ 121.61 W之流體與加熱面平均熱阻僅0.161 K/W，適合用於實際電腦散熱裝置。

關鍵字

噴擊冷卻 ； 針狀表面 ； 槽道表面 ； 非導電流體FC-72

並列摘要

Recent advancing technologies have caused the computer chips development toward increasing densities of circuits, and increasing heat dissipation. Therefore, an effective cooling system is required for computer chips. This study uses dielectric fluid FC-72 as the working fluid in a jet cooling device. In the present experiment, the system temperature of jet cooling device is set at 50℃. The fluid distributor plate has 5 or 9 pores of 0.24 mm diameter. The distance from distributor plate to the test surface was 5 mm, and the heated area of the test surface is 12×12 mm2. The test surfaces include: a smooth surface, a pin-fin surface and a straight fin surfaces of 400μm fin height, thickness and gap width, a pin-fin surface and a straight fin surface of 800μm fin height, 200μm fin thickness and gap width. The flow direction of jet impingement includes downward and sideward, and the volume flow rate varies from 50 to 150 ml/min. The result shows that increasing flow rate can increase heat transfer performance. The heat transfer performance of downward jet cooling is greater than that of sideward jet cooling. The pin fin surface of 800μm fin height ,200μm fin thickness and gap width yields the best performance, which is about 250 % greater than the smooth surface at 150 ml/min. The average thermal resistance of this pin fin surface is 0.161 K/W at 8.91 ~ 121.61 W of heat input when the present jet cooling system operates at 150 ml/min. This jet cooling device is found to be a promising chip cooling solution for its low thermal resistance.

並列關鍵字

Jet cooling ； Pin fin surface ； Straight fin surface ； Dielectric fluid FC-72

參考文獻

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