正向與反向的CMOS-MEMS電容式麥克風整合研發

Development of frontside/backside-direction capacitive microphone base on CMOS-MEMS process

朱哲謙(che-chien Chu)

指導教授 ： 黃榮堂

國立臺北科技大學/機電學院/機電整合研究所/碩士(2012年)

摘要

CMOS-MEMS製程設計可以達到微小化、低成本及大量生產之優點，同時也可與一般IC製程相容，易於與IC電路整合，形成微機電系統。本論文提出一種設計方法可以將兩種不同的麥克風結構做在同一晶片上，並設計一種製程方法可同時將兩種不同結構的麥克風製作完成，且可與CMOS電路整合微晶片，完成CMOS-MEMS電容式麥克風。模擬上藉由Coventor Ware模擬軟體分析麥克風薄膜結構，包括薄膜中心變形量、初始電容值、電容值變化量；製程上利用乾、溼蝕刻製程以及超臨界乾燥機使麥克風完成製作，最後利用覆晶封裝技術使得指向性麥克風性質可以更加良好。

關鍵字

CMOS ； 微機電 ； 指向性 ； 微麥克風陣列

並列摘要

CMOS-MEMS process can achieve miniaturization, low cost and mass production. Because of the CMOS-MEMS process can integral of general IC process and IC circuit which can become Micro-Electro-Mechanical-System. This study provides a design way to combine two different microphone structures on the same chip and then design a process to make two different microphone structures be finished in one time, moreover, after two microphone structures are finished to combine CMOS circuit become micro-chip which is CMOS-MEMS capacitive microphone. Simulation by Coventor Ware to simulate microphone membrane、membrane deflection、initial capacitance and capacitance change; this process use dry-etch、wet-etch and CO2 Supercritical Dry Release to finish this study. Eventually, we use Flip-Chip package technology to make property better.

並列關鍵字

CMOS ； MEMS ； directional, ； Microphone array

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