氯化銅蝕刻廢液回收再利用之研究

A Study on the Recovery and Reclamation of Wasted Etching Solution Containing Copper Chloride

蔡泓欣(Hung-Hsin Tsai)

指導教授 ： 蔡德華

國立臺北科技大學/工程學院/化學工程所/碩士(2005年)

摘要

本研究依據印刷電路板廠所產生之酸性氯化銅蝕刻廢液，依其性質，自行配置模擬含銅離子(Cu2+)與自由酸(HCl)之蝕刻廢液，且藉著氧化銅的添加，使溶液達到飽和狀態，並以真空蒸發濃縮系統來回收此高濃度的氯化銅蝕刻廢液，以達到混合液濃縮之目的，並將濃縮液利用低溫過飽和原理予以冷卻而析出氯化銅結晶，且將氯化銅晶體進行資源化產品的探討；最後藉由改變不同的冷卻溫度與氧化銅添加量，對氯化銅結晶的產量與鹽酸之回收濃度影響，進而尋求最佳之回收操作參數，因此對於一個環境和經濟的考慮，從蝕刻液回收有用的資源是重要的。
實驗結果顯示，(1)氧化銅在模擬之氯化銅蝕刻廢液中之溶解度隨著反應溫度上升而緩慢上升。(2) 使用XRD、SEM、AAS與TGA來分析描述資源化產品氯化銅晶體(CuCl2．2H2O)之物理性質，此晶體呈針狀堆疊、純度達99.8221%以上且在110℃左右完全失去兩個結晶水。(3)氯化銅結晶之析出量隨著濃縮液之冷卻溫度不同而異。(4)在不同氧化銅添加量下，可回收不同濃度的鹽酸(HCl)。

關鍵字

印刷電路板 ； 蝕刻廢液 ； 真空蒸發 ； 氯化銅

並列摘要

In this study，synthesis wasted liquids containing various concentration of copper ion (Cu2+) and free acid (HCl) were prepared in order to simulate the real characteristics of wasted etching liquid containing acidic copper chloride which is generated from the printed circuit board (PCB) industry. A first step in which a solid of copper oxide is added to acidic copper chloride solution，to make solution reach saturated condition. The second step in which utilized the low temperature oversaturation principle to cool the copper chloride solution to obtain crystals which in the first step is concentrated by vacuum evaporation system，in order to achieve the purpose of mixture. Finally，the quality of crystals and concentration of hydrochloride acid were discussed by changing different cooling temperature and the adding amount of copper oxide，and then find out the operate parameter in the best recovery . Therefore，in an environmental and economic point of view，the retrieval of the valuable natural resource from waste etching solution is important.
This results of experiment shows：(1)The solubility of copper oxide increased with the increase of reaction temperature in the simulate wasted etching liquid containing copper chloride.(2)The reclamation products of copper chloride dihydrate (CuCl2．2H2O) were analyzed and characterized by using XRD、SEM、AAS and TGA. Since copper chloride dihydrate has a needle stack form crystal morphology、a purity of more than 99.8221 wt% and dehydrate at 110 ℃. (3)The crystallization quality of copper chloride dihydrate is different with cooling temperature of concentration solution. (4) Under the different adding amount of copper oxide，the recovery concentration of hydrochloride acid is different.

並列關鍵字

Printed Circuit Board ； Wasted Etching Solution ； Vacuum Evaporation ； Copper Chloride

參考文獻

67.楊寶旺、雷敏宏、廖德章，化學，高立出版社，1995。

25.C. R. Shipely, “Etchant for curpreous metals”, U. S. Patent 3650958， 1972。

39.R. R. Swanson, “Compositions containing phenlolic oximes and certain α-hydroxy aliphatic oximes”,U.S.Patent 3592775，1971。

40.R. R. Swanson, “Extraction of copper from acidicliquors with a phenolic oxime”, U.S. Patent 3428449，1969。

43.V. H. Thomas, P. Alan, “Solvent extraction and electrowinning of copper”, U. S. Patent 3703451，1972。