AA/DMC兩性聚電解質合成技術及其於CMP級二氧化矽研磨粉體分散穩定性應用研究

Synthesis of AA/DMC amphoteric polyelectrolyte block copolymer and its application to the dispersion of CMP silicon oxide

張婉珍(Wan-Chen Chang)

指導教授 ： 陳志恆

國立臺北科技大學/工程學院/資源工程研究所/碩士(2011年)

摘要

本研究中以自由基聚合法合成之兩性聚電解質，主要是由兩種單體所構成。陰離子部分的單體-丙烯酸(Acrylic acid, AA)和陽離子部分的單體-丙烯醯氧乙基三甲基氯化銨(methacryloxyethyltrimethyl ammonium chloride, DMC)。實驗中藉著調整合成的兩性聚電解質中兩種單體莫耳比例，使其應用時帶有不同陰陽離子比。將合成後之聚電解質以FTIR、IC、AA、NMR、GPC來作為分子結構上的確認。並以合成後之兩性聚電解質應用於二氧化矽粉體在酸性及鹼性條件下的分散，在矽晶圓CMP製程應用方面(pH 10)，二氧化矽膠體分散液中聚電解質(AA：DMC=1：4)、(AA：DMC=2：3)、(AA：DMC=3：2)及(AA：DMC=4：1) 的最適添加量分別為12wt%、14wt%、10wt%及14wt%。穩定性會隨著陰離子區段的比例增加而增加。與一般使用界面活性劑相比之下添加量較少。在酸性條件下(pH 3)，二氧化矽膠體分散液中聚電解質(AA：DMC=1：4)、(AA：DMC=2：3)、(AA：DMC=3：2)及(AA：DMC=4：1)的最適添加量分別為1.7wt%、2.5wt%、2.6wt%及1.9wt%，穩定性會隨著陽離子區段的比例增加而增加。

關鍵字

二氧化矽膠體穩定性 ； 化學機械研磨 ； 分散 ； 兩性聚電解質

並列摘要

A series of amphoteric polyelectrolyte block copolymers with different molecular cationic and anionic segment ratio were prepared by the radical copolymerization of acrylic acid (AA) as anionic monomer with methacryloxyethyltrimethyl ammonium chloride (DMC) as cationic monomer. By adjusting the ratio of anionic and cationic monomers, the synthesized amphoteric polyelectrolyte had different The result showed that when particle dispersion was applied in different dissociation, the amphoteric polyelectrolyte had different anionic-group/ cationic group content. The structures and properties of the amphoteric polyelectrolyte were confirmed by FTIR、IC、AA、NMR、GPC. Then, the amphoteric polyelectrolyte was used by using for the disperse dispersion of SiO2 particles of in acid or basic in solution. For silicon wafer CMP application (pH=10), the SiO2 particles can be dispersed by the addition of optima amount of polyelectrolyte (AA：DMC=1：4), (AA：DMC=2：3), (AA：DMC=3：2) and (AA：DMC=4：1) in 12wt%、14wt%、10wt% and 14wt%, respectively. The amount of added polyelectrolyte was significantly lower than that of conventional surfactant. At pH=10, it was found that the stability of SiO2 particles increased with increasing anionic-group content. In the acid conditions (pH=3), the SiO2 particles can be dispersed by the addition of optima amount of polyelectrolyte (AA：DMC=1：4), (AA：DMC=2：3), (AA：DMC=3：2) and (AA：DMC=4：1) in 1.7wt%、2.5wt%、2.6wt%及1.9wt%, respectively. At pH 10, it was found that the stability of SiO2 particles increased with increasing cationic-group content.

並列關鍵字

SiO2 colloid stability ； Chemical Mechanical Polishing ； Dispersion ； amphoteric polyelectrolyte

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