不同基材的化學鍍銅研究及其動力學探討

Studies of Chemical Copper Plating and Kinetics behavior

吳宗憲(Tseng-Hsien Wu)

指導教授 ： 張俊賢

國立臺北科技大學/工程學院/化學工程所/碩士(2005年)

摘要

本研究針對聚酯織物及薄片與其它基材進行無電電鍍金屬披覆，主要探討無電電鍍銅於不同操作條件下對沈積速率及形態的影響，不同基材的無電鍍銅的現象。基材以光學顯微鏡及掃描式電子顯微鏡SEM(Scanning Electron Microscope ;SEM)探討觀察鍍層之均勻性、化學銅粒子大小及化學銅析鍍層之表面型態。探討無電電鍍銅於操作下鍍層之表面電阻係數，比較銅金屬不同操作條件下表面電阻係數之相關性，並以表面電阻係數對電磁波遮蔽效率做評估，以預期織物之金屬披覆層對電磁波之遮蔽特性，利用X光繞射儀(X-ray Powder Diffractometer ; XRPD)探討銅鍍層之結構。本研究並利用原子吸收光譜儀(atomic absorption spectrophotometer)分析無電鍍銅其動力學現象，並在鍍著過程施以超音波震盪，探討超音波震盪對無電鍍銅的動力學之影響，再經由實驗求得無電電鍍銅之沈積速率經驗式。

關鍵字

無電鍍銅 ； 超音波震盪 ； 鍍銅表面形態 ； 表面電阻

並列摘要

We investigate electroless copper plating on poly ethylene terephthalate(PET) fabric, sheet, and other substrates. Discuss the effects of different operating conditions to deposition rate and morphology change on defferent substrates. We use optical microscope and Scanning Electron Microscope(SEM) observe surface structure with diffetent concentration of additive. Also we use four-point probe to discuss variation of surface resistance. Estimate effect of its electromagnetic interference shielding Effectiveness (EMISE) by surface resistance. Using X-ray Powder Diffractometer ; XRPD to discuss the structure of plated copper.
We use Atomic Absorption spectrometer (AA) to determine variation of concentration of plating bath. During plating procedure, we use ultrasound agitation to see its effect to electroless copper plating and to derive kinetics equations.

並列關鍵字

Electroless Copper Plating ； Ultrasound Agitation ； Surface Morphology ； Resistivity

參考文獻

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[4] Aina Hung, "Electroless Copper Deposition with Hypophosphite as Reducing Agent," Plating and Surface Finishing,Vol.75, No.1, pp.62-65, 1988

[5] Pei-Chi Yen, "Improved ABS plastic activating treatment for electroless copper plating," Polymer Communications, vol. 36, no. 17, 1995, pp. 3399-3400.

[6] L. G. Bhatgadde, S. Joseph, S. C. Kulkarni, "Electroless copper/nickel/gold plating of ferrite substrates," Metal Finishing, april, 1996, pp. 45-51.