- 學位論文
噴擊冷卻三維鰭片流道應用於晶片散熱之模擬與實驗研究
A Numerical and Experimental Study on Three Dimensional Channels with Impinging Jets for Chip Cooling
摘要
本研究整合噴擊冷卻與微流道冷卻兩種散熱機制，設計具有三維鰭片結構微流道與噴擊孔之散熱機構。在投影面積為12×14 mm2的散熱器中，建立11條高0.8 mm，寬0.6 mm，長12 mm之微流道，流道底部設有微鰭片，微鰭片高0.3 mm，寬0.2 mm，長度12 mm；並於每片微鰭片上方每隔0.8 mm設直徑0.4 mm，深度0.8 mm之圓孔。本研究工作流體為FC-72，入口飽和溫度為30℃及50℃，入口流量為100~450 ml/min，進行數值模擬與實驗。結果發現，在微流道中增設三維鰭片結構，在單相熱對流時，可增強流場擾動；在雙相熱傳時，三維鰭片形成之氣孔有助於降低成核沸騰所需壁面過熱度；兩種效應皆能提升熱傳性能。本研究在飽和溫度30℃，高流量400ml/min之條件下，可達最高之熱通量為134 W/cm2；在飽和溫度50℃，高流量400ml/min時，有最低之熱阻抗值0.0768 K/W。
並列摘要
This study investigated three dimensional micro-channels heat sink integrated with micro jets. The working fluid was introduced to a 12×14 mm2 heated surface, which had 11 micro-channels. Each channel was 0.6 mm wide, 0.8 mm high, and 12 mm in length. Micro-fins of 0.3 mm in height, 0.2 mm in width, and 12 mm in length was made on the bottom of each channel. Hole of 0.4 mm diameter, 0.8 mm depth, and 0.8 mm pitch was drilled from the top of each micro-fin. In this experimental and numerical study, the working fluid is FC-72. The saturation temperature of cooling device system was set at 30℃and 50℃, and the volume flow rate varied from 100 to 450 ml/min. The experimental results showed that heat transfer performance was enhanced by the three dimensional fins for both single phase and two phase modes. Enhanced flow field disturbance was found from numerical simulation, and reductions in the wall superheat required to initiate boiling were measured with three dimensional micro-fin-channels. In this study, at the saturation temperature of 30 ℃, and the flow rate of 400 ml/min, the heat sink yields the maximum heat flux of 134 W/cm2, at the saturation temperature of 50 ℃, and the flow rate of 400 ml/min , the heat sink yields the lowest thermal resistance of 0.0768K / W.