超音波輔助活性軟銲接合應用於微模具增厚之研究

A Study on Ultrasonic Assistant Activated Solder Applied on the Increased Thickness of Micromold

周志鏵(Chih-Hua Chou)

指導教授 ： 蘇程裕

國立臺北科技大學/機電學院/製造科技研究所/碩士(2005年)

摘要

本研究主要針對微射出模具之增厚製程進行研究。研究中提出一種超音波輔助活性軟銲製程，其特點為兼具低溫、快速和製程設備簡便。
此種製程建立觀念主要在跳脫傳統錫銲接合製程觀念，使用一種於銲料中添加微量活性元素的低溫無鉛活性銲料（activated solder），可直接潤溼金屬和陶瓷表面；軟銲過程中待接合面無須金屬化（metallization）、無須使用助銲劑（fluxes）及在保護氣氛或真空中進行接合，達到無鉛環保和單一製程化的要求。研究首先針對活性銲料接合特性設計並組裝一套超音波輔助活性銲機。組裝完成後以活性銲料接合SKD 11工具鋼-Ni基板，並針對實驗參數中，超音波振盪時間、施銲方式、振幅大小探討其對接合之影響。
實驗參數結果顯示使用本研究之超音波輔助活性銲機，添加活性銲料，可在大氣環境、不使用助銲劑並在短循環時間內完成接合。藉由不同分析結果得知，在超音波振盪時間15秒時，其有最低的超音波振幅、最低的殘留應力，對於接合基材表面有良好的潤濕效果及其與銲料較完全的交互反應，並由剪力實驗證明，破斷表面呈現強度較高的延性破斷結構，並且有最佳的接合強度25.03 MPa，將提高微射出模具之製程效能以及利益。

關鍵字

模具 ； 活性元素 ； 活性銲料 ； 金屬化 ； 助銲劑

並列摘要

The aim of this research focuses on the topic of increasing thickness in micromold. A ultrasonic assistant activated solder process, which has some characteristics of low temperature, fast, and simplicity.
The low and lead-free activated solder with some active elements can wet the surface between metals and ceramics. No metallization, fluxes, shielding gas, and vacuum chambers will be used during the process; in addition, it can achieve the goals for environments and mono-process. In this study, a set of ultrasonic assistant activated welding machine was designed for the bonding features of activated solder.Oscillation time, the welding methods and amplitude for SKD 11 tool steel, which is our base plate, will be discussed.
The results reveal that the bonding will be finished by our equipment in the atmosphere if the activated solder and no fluxes are used. The analyses also show that the lowest ultrasonic amplitude and the residual stress are occurred at 15 seconds for oscillating. The interaction between base materials and solders is wetted very well and the ductile structure in the broken surface has excellent strength from the shear experiment and the best bonding strength is 25.03 Mpa. It will enhance the performance and benefits in the process for micromold.

並列關鍵字

Micromold ； Activated Element ； Activated Solder ； Metallization ； Fluxes

參考文獻

[8]H. Mizuhara and K. Mally, Welding Journal, 10 ,1985, p27.

[9]E.P. Wood and K.L. Nimmo, “In Search of New Lead-Free Electronic Solders,”

A. Journal of Electronic Materials 23 (8) ,1994, p709.

[19]R. R. Tummala, E. J. Rymaszewski, and A. G. Klopfenstein, Microelectronics

[20]N. C. Lee, “Getting Ready for Lead-Free Solders,” Soldering and Surface Mount