- 學位論文
液冷式散熱模組之流道設計與散熱效益之研究
The Study on Design of Flow path and Effect of Heat Removal for Liquid-cooled Thermal Module
摘要
半導體元件隨著效能的增進、功率的提升導致散熱需求量大增，因此提高散熱鰭片的散熱量，是當前重要的課題。使用水冷系統能有效的解決此問題，本文主要針對水冷系統中，微晶片發熱所使用的液冷式散熱模組，改變其流道內幾何的變化對於散熱模組散熱效益的影響作為探討，藉由計算流體力學軟體並以實際實驗驗證。本文將分析三種型態之散熱模組，來探討其散熱性能的變化與影響，利用計算流體力學軟體FLUENT計算三種不同模組之散熱鰭片，在不同的CPU瓦數下探討熱傳導問題並觀察內部流場變化與溫度場分佈情況及利用實驗來驗證數值模擬散熱模組的準確性，之後再利用計算流體力學預測其不同流速下的流場變化與溫度場分佈情形。經模擬分析與實驗結果可發現，散熱模組的熱阻值不會隨著瓦數的提升而有明顯變化，而是隨著流速的增加，熱阻值反而變小，最後歸納出散熱效果最好的是蛇型圓柱複合型流道，次之則是蛇行流道，圓柱型流道最差，其熱阻值分別是0.08℃/W、0.1℃/W、0.15℃/W。
並列摘要
The demand for heat elimination increases greatly as the efficiency and power of semiconductor components increase; hence, increasing the heat dissipating capacity of cooling fins is an important topic at present. The water cooling system is an effective method. This study aimed to discuss the effect of changing the geometry inside the flow channel of the liquid-cooled cooling module for microchip radiation in the water cooling system on the cooling efficiency of the cooling module. It also used the CFD software and actual experiment for verification. Three types of cooling modules were analyzed to discuss the variance in heat dispersion and the influence. CFD software FLUENT was used to calculate the cooling fins of three modules, in order to further discuss the heat conduction problem and observe the changes in internal flow field and the distribution of temperature field at different CPU wattages, and verify the accuracy of cooling modules of numerical simulation through experiment. The CFD was used to predict the flow field change and temperature field distribution at different flow velocities. According to simulation analysis and experimental results, the thermal resistance value of cooling module will not change obviously as the wattage increases, and the thermal resistance value decreases as the flow velocity increases. The snakelike cylindrical composite flow channel has the best cooling effect, followed by the snakelike flow channel, and the cylindrical flow channel has the worst effect. The thermal resistance values are 0.08℃/W, 0.1℃/W and 0.15℃/W respectively.