微電子散熱模組流道設計與散熱效能之研究

A Study on the Design of Flow Channels and the Effect of Heat Removal for Microelectronic Heat-Dissipating Modules

劉建辰(Chien-Chen Liu)

指導教授 ： 鄧治東

中原大學/工學院/機械工程學系/碩士(2007年)

https://doi.org/10.6840/cycu200700616

摘要

本文中針對微晶片所使用的液冷式散熱座散熱模組，藉由計算流體力學軟體並以實際實驗方式驗證之。文中所使用的計算流體力學軟體為ICEPAK，應用有限體積法（Finite-volume method）將統御方程式利用控制體積積分法（Control Volume Integration Approach），將積分式的統御方程式轉換成有限差分方法，運用上風有限差分法將偏微分方程式離散化求解三維穩態、流場與熱傳導問題，預測其流場變化與溫度場分佈情況。並結合SIMPLE演算法求解壓力、速度問題，在其求解區建構交錯式非結構網格，於特定區域加密網格配置以提升其結果之準確性。
文中以自製新型液冷式流道並做以下參數分析，所考量之參數分別為流道幾何形狀、體積流率(0.1~0.7 L/min)。實驗結果顯示在水冷式散熱模組中，流道的形狀設計對於其散熱座散熱效果具相當的影響，流道的建立於最佳情況下可提升散熱模組62.6%之散熱效能，其中又以圓柱型散熱座所產生的渦流流場散熱效果為最佳。而研究結果亦顯示其散熱座之熱阻值隨著體積流率之增加而降低，但將趨於平緩。最後經由模擬分析結果顯示液冷式散熱模組之最佳散熱效能為傳統式氣冷式的3.5倍。

關鍵字

散熱模組 ； 電子冷卻

並列摘要

Abstract
This study used computation fluid dynamics software Icepak (version 4.0) to analyze the liquid-cooled heat dissipating modules as thermal management measures for microchip. The analyzed results were then verified by experimental data. The software Icepak was based on finite-volume method that transforms the governing equation into finite-difference method by control volume integration approach. In addition, simulation of the distributions of flow field and temperature field was done by upwind differencing scheme to solve the heat conduction in a three-dimensional steady flow field by using SIMPLE algorithm to solve the pressure and velocity. In order to increase the accuracy of computational results, staggered unstructure grid in specific regions was implemented in the grid generation process..

In this study, parameters used in sensitivity evaluations include the shapes of channel in heat-dissipating plate, volumetric flow rates (0.1~0.7 L/min). The result obtained from this study showed that the shapes of channels in heat-dissipating plates played an important role in the thermal management of the chip; it can improve about 62.6% of heat-dissipating efficiency in the optimal channel design condition. The heat-dissipating efficiency for vortex flow field was better than the other in a laminar flow field. And the results showed that resistance of heat-dissipating plate decreased gently by increasing the volumetric flow rate in the flow channel. Finally, the results obtained from computer simulation showed that the optimal heat-dissipating efficiency of liquid-cooled heat dissipating modules considered in this study was 350% of what the traditional air-cooled heat dissipating modules could achieve.

並列關鍵字

ICEPAK

參考文獻

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