- 學位論文
液晶電視電源供應器模組之數值分析
A Numerical Analysis on the Power Supply Modules for LCD Monitor
摘要
摘要 本研究之目的在於利用數值模擬分析軟體建立液晶電視電源供應器之模組，並規劃相關實驗流程進行實驗模組之測試，進而從事模組參數設計與分析。 本文所使用之電源供應器之模組，其輸出功率為210瓦特，並針對模組內主要高發熱元件作探討，在設計模組時如何配置高溫元件為重要考量。模組藉由Icepak計算流體力學分析軟體進行數值模擬，所得之數據與實驗所得之數據進行比較分析，可得數值模擬在電源供應器模組之可行性與可靠度。在本文中更針對其散熱片之尺寸作規劃與量測，且模組內各電子元件符合溫度規範之需求。 本研究結果顯示模組之模擬值與實驗值甚為吻合，並從不同模組放置方式之結果得知模組內熱對流現象對於電子元件之影響微弱，此外藉由模擬分析軟體針對散熱片作參數分析，可觀察其電子元件溫度之趨勢，在未來研發電子產品時，可作為參考依據。 關鍵字：電源供應器、Icepak、數值模擬、溫度規範
並列摘要
Abstract A numerical research by computational fluid dynamic (CFD) software performs to investigate the power supply modules for LCD monitor and an experimental procedure manages to examine modules. Moreover, this research analyzes and designs relevant parameters for power supply modules. The power supply module provides 210 W power sources for LCD monitor and this research discusses phenomena of high-power components in this module. In addition, how to configure high-power components in the module is an important criterion for manufacture. This research performs numerical simulations with the CFD software Icepak and the numerical results will compare with the experimental results to evaluate the feasibility and accuracy. Furthermore, the analysis of heat sink constructs different geometry to measure heat-dissipating efficiency. Most important, all components will under the spec. temperature requirement. The result shows that numerical data is good agreement with experimental data. Moreover, different position of modules indicates that there is no obvious heat convection phenomenon in the modules and affects components temperature slightly. Besides, analysis of heat sink can observe each component’s temperature tendency and establish a standard for manufacture electronic equipments in the future. Keywords: power supply, Icepak, numerical simulation, spec. temperature requirement