中文摘要 筆記型電腦所使用的可攜式電源供應器(AC/DC Adaptor),範圍從65瓦到240瓦,因其是可攜式的,故設計此產品都往輕、薄、短小的方向發展,但其功率密度隨著體積縮小而增加,所產生的熱消耗密度也相對的增加。 目前筆記型電腦之可攜式電源供應器為封閉的電子系統,無法使用強制冷卻的方式來降低內部發熱元件的溫度,如何佈線與機構包裝,將電子元件的熱均勻散佈在內部的空間,再藉由塑膠外殼傳導熱至自然對流的空氣中,使電子元件的溫度能符合各國安規的要求,是至為重要的課題。 因現行CAE軟體發展迅速,如何使用Ansys Workbench套裝模擬軟體進行穩態熱傳模擬分析,使得電子冷卻構裝達到最佳化,節省研發時間及減少材料成本,是本論文所要研究的方向。
ABSTRACT The power provided by portable AC/DC adapter for notebook computers ranges from 65 W to 240 W. Due to the fact that notebook computers are designed as light, thin, and compact, their power densities increase as a result of their smaller body size. However, its thermal density is also increased simultaneously. Portable AC/DC Adapter for notebook computer is working in the enclosed environments; its heating components cannot be cooled down by inter-cooler system. Therefore, it is crucial to implement appropriate layout, bonding, and packaging, making inside thermal spread evenly in the enclosed environments. Moreover, it is very important to meet the safety requirements of various countries to ensure that the heat generated inside the adapter can be spread through the plastic case to outside environment. This study has demonstrated that a powerful CAE software, the Ansys Workbench is capable of simulating and calculating the steady-state thermal spread temperature profile, optimizing the design for component cooling mechanism, and saving R&D time and cost.