- 學位論文
高瓦特數電源供應器之熱流行為研究
A Study on the Thermo-Fluidic Behavior of High-Wattage Power Supply
摘要
中文摘要 本文針對桌上型電腦所使用之1000 瓦特（W）交換式電源供應器（Switching Power Supply, SPS）進行實驗測試及數值模擬其散熱性能。由實驗量測可知本模組之總輸入電壓為112.9 伏特（V），電流為11.8安培（A），總輸入功率為1328.8 W，總輸出功率為1000 W，因此本電源供應器之效率為75.24%。本研究主要藉由實驗數據印證其數值模擬之準確性，並針對模組內部的主要發熱電子元件進行溫度探討。 本研究使用計算流體力學（Computational Fluid Dynamics, CFD）軟體ICEPAK進行數值分析，將其模擬結果與實驗數據做比對，兩者之最大溫度差值為6.93％，溫度差為5.7℃，因此模擬數值有其準確性。再藉由此模擬軟體對模組內部之主要發熱電子元件的溫度場及流場做分析，針對內置鋁擠散熱片之外型與改變模組內部之風流這兩個方向進行討論，經由散熱片及流場之重新設計使BD1元件溫度差值降低9.6％，溫度降低8.7℃，其平均溫度差值降低3.8％，溫度差為3.2℃，藉此提升此模組之效率，希望本模組可藉由有效的散熱方式以及內部流廠的改善，使得電源效率達到80％的標準。
並列摘要
Abstract The purpose of this study was to investigate – by experimental and computer simulation methodologies – the behavior of the heat-dissipating performance for the switching power supply (SPS) with a power of 1000 W. The SPS module used has a voltage of 112.9 V, a current of 11.8 A, an overall input power of 1328.8 W, and an overall output power of 1000 W, leading to an efficiency of 75.24% for the power supply module. This study intended to use the experimental data to verify the correctness of the numerical simulations and to evaluate the temperatures of the heat-dissipating components inside the power supply module. This study used the Computational Fluid Dynamics (CFD) methodology – the ICEPAK software package – to perform numerical simulations. Comparison between simulated results with those obtained from experiments indicated that the maximum temperature difference between the two sets of results is 5.7℃, or 6.93% using the experimental data as the reference for comparisons, reflecting reasonable good results obtained from the numerical simulations. Subsequently, numerical simulations were done to study the temperature and flow fields of the heat-dissipating components inside the power supply module, with the two key factors – the built-in aluminum extrusion-type heat sink and the forced-convection flow – being analyzed. By improved design of the heat sink together with its convective flow field, a reduction of temperature of 8.7℃ (or a 9.6% reduction of its temperature difference when comparing the results obtained before and after the redesign) with an overall average temperature reduction of 3.2℃ (or 3.8% on a percentage basis). Thus, enhancement of the thermal performance was achieved by the redesign of the heat sink together with its flow field. It is expected that by this kind of redesign, the thermal performance of the heat-dissipating module can reach its standard specification efficiency of 80%.