水冷式散熱座冷卻效益之研究

The Study of Cooling Effectiveness in a Water Cooled Heat Sink

宋志傑(Chih-chieh Sung)

指導教授 ： 郭鴻森

大同大學/工程學院/機械工程學系所/碩士(2010年)

摘要

隨著電子產業蓬勃發展，製程技術上的突破，晶片工作時脈迅速向上提升，單位面積所受的功率及相對的發熱量也不停的攀升，晶片溫度 若過高，將造成熱阻而影響內部資料的運算，降低電腦處理效率。降低晶片的工作溫度，可避免晶片因高溫而燒毀，並且穩定電腦處理效率，因此散熱早已成為所有電腦相關產業所注重的問題。
本文中分析研究三種型態水冷頭，S型和鰭片型流道是屬於全銅材質，而一進側出型流道是塑膠上蓋銅底板，探討散熱性能的變化與影響分析並以實際樣品驗證。經分析模擬及實驗結果可歸納結論如下：S型流道、鰭片型流道、一進側出型流道，散熱效果最好的是S型，一進側出型次之，鰭片型最差，熱阻值分別是0.223、0.229、0.231℃/W。此實驗和模擬分析結果的水冷頭優劣趨勢是相同，也證明數值模擬在產品設計上可做來判斷的依據。

關鍵字

數值模 ； 熱阻值 ； 水冷頭

並列摘要

With the rapid development of the electronic manufacturing technologies, the operating frequency of CPU has also increased. This leads to higher power and heat dissipation per unit area. However, the higher temperature will cause higher thermal resistance to impact the CPU calculation performance and reduce computer's efficiency. Reducing the operating temperature of CPU can avoid the chip failure, providing higher temperature stability and computer's efficiency. Therefore, the thermal management has become key point of all the computer industries.
This article analyzed three types of waterblock: S-type, fin-type, and Side-type. S-type and fin-type are manufactured by copper, Side-out type is combined with plastic cover and the copper plate. After verified by numerical simulation and experimental results of these tree types of waterblock, the conclusion can be summarized as follows: thermal resistances of S-type, Side-out type, and fin-type are 0.223,0.229,and 0.231℃/W, respectively. The results of numerical simulation and experimental data in these tree types of waterblock have the same heat cooling feature. The methods of numerical simulation and experimental measurement have been proved as useful tools in the product design.

並列關鍵字

numerical simulation ； resistance ； waterblock

參考文獻

[12] 劉建辰, “微電子散熱模組流道設計與散熱效能之研究”,中原大學,機械工程學系,碩士論文,2007.

[13] 王祟岳, “桌上型電腦散熱模組之參數分析”,中原大學,機械工程學系,碩士論文,2005.

[2] Zahn B.A.,“Evaluating Thermal Characterization Accuracy Using CFD Codes-A Package Level Benchmark Study of Icepak and Flotherm”,IEEE,1998.

[3] Lee T.Y., “Design Optimization of an Integrated Liquid-Cooled IGBT Power Module Using CFD Technique” IEEE Transactions on Components and Packaging Technologies, Vol.23, No.1, March 2000.

[4] Baumann H., Heninemeyer P., Staiger W., Topfer M., Unger K., Muller D., “Optimization of the Design Parameters of Parallel-Plain Fin Heat Sink Module Cooling Phenomenon Based on the Taguchi Method”, IEEE Trans on Industrial Electronic, Vol. 48, No.2, 2001.