超音波輔助活性軟銲接合陶瓷與銅之研究

The Study on the Joining of Ceramic/Copper using Ultrasonics-Aided Activated Solder Technique

蔡振法(Chen-Fa Tsai)

指導教授 ： 蘇程裕

國立臺北科技大學/機電學院/機電整合研究所/碩士(2005年)

https://doi.org/10.6841/NTUT.2005.00122

摘要

本研究目的在於跳脫傳統錫銲接合製程觀念，使用一種低溫無鉛活性銲料(activated solder)，於Sn-Ag合金中添加活性元素Ti及稀土金屬Ce與Ga元素，藉由超音波振盪來輔助接合陶瓷和銅。軟銲過程中待接合面無須預金屬化、助銲劑及保護氣氛下或真空中進行接合，可達到環保和單一製程化的要求。
本研究接合材料為氧化鋁、氧化鋯及銅板，藉由超音波輔助活性銲料在振幅12μm及振盪時間分別為5、10、15、20及30sec下完成氧化鋁/銅及氧化鋯/銅之接合。研究結果顯示，超音波振盪時間在15sec的接合效果最顯著，平均剪力強度為37.9~38.4Mpa，斷裂處大都以陶瓷與接合界面混合之破斷方式；並發現在振盪5秒條件下，銲料與銅板界面處便有一層連續Cu-Sn的反應層。接合後之試片，經260℃/24hr時效反應後，發現Ti元素聚集於銲料與陶瓷界面處形成一層極薄的反應層且發現在銲料與銅之反應界面有了明顯顏色不同之兩層介金屬層生成，靠近銲料端的介金屬層為Cu6Sn5，Cu片端的是Cu3Sn；而Cu6Sn5化合物從原本未時效10μm成長為25μm。另外Cu3Sn化合物厚度也會隨著時效時間延長而成長。本實驗利用超音波輔助活性銲料接合陶瓷-銅，在持溫24小時的條件下，Ti原子即能和陶瓷明顯起反應，即使本實驗接合溫度為260℃。因此，只要適當調整超音波振盪時間及接合後持溫的控制，將對銲料與基材的鍵結有很大的幫助。

關鍵字

軟銲 ； 活性銲料

並列摘要

The aim of this study was to develop a novel join process by using a low temperature activated solder that be added activated elements, such as: Ti, Ce and Ga in the Sn-based filler metal. The mechanics of ultrasonic vibration be used to aid in this process. Premetallization, flux and shielding gas are not used during this process, which conforms to the demand for environment protection and simply the process.
The joining couple of Al2O3/Cu and ZrO2/Cu by the ultrasonics-aided activated solder can be accomplished under the conditions of amplitude of ultrasonic horn top 12μm on the different duration of 5, 10, 15, 20 and 30sec. The results reveal that the shear strengths of two materials are 37.9 and 38.4 Mpa in 15sec vibration. After vibrating 5 seconds, there is a continuous Cu-Sn layer shown in the interface between active filler metal-copper substrate. Ti element is found to aggregate, forming an ultra-fine reaction layer in the active filler metal-ceramic joint after 260℃/24hr aging treatment. Two different-color intermetallic compounds are observed in the interface of active filler metal-copper. One is Cu6Sn5 , which is closer to active filler metals；the other is Cu3Sn, which is closer to the copper substrate. Cu6Sn5 compounds grow from 10μm to 25μm. The thickness of Cu3Sn grows by extending the aging time. In this experiment, ultrasonics-aided activated solder process is used to join ceramics and copper. Being kept in the temperature after 24 hours, Ti atoms can aggregated at the interface of ceramic-active filler metal. Hence, ultrasonic vibration time and controlling the holding time will be helpful for bonding active filler metal and base materials.

並列關鍵字

solder ； activated solder

參考文獻

[13] S. Matsuoka, “Ultrasonic Welding of Ceramics-Metals Using Inserts,” J. Mater. Process. Tech., 75, 1998, pp.259-265.

[14] S. Matsuoka, “Ultrasonic Welding of Ceramics-Metals,” J. Mater. Process. Tech., 47, 1994, pp.185-196.

[20] W. J. Plumbridge, “Solders in Electronics,” Journal of Materials Science, 31, 1996, pp.2501-2514.

[24] M. G. Nicholas, “Some Observations on the Wetting and Bonding of Nitride Ceramic,” Materials Science, 25(6), 1990, pp.2679-2689.

[34] Y. H. Chai, W. P. Weng, and T. H. Chuang, “Relationship Between Wettability and Interfacial Reaction for Sn10Ag4Ti on Al2O3 and SiC Substrates,” Ceramics International, 24(4), 1998, pp.273-279.