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  • 學位論文

結合部份電磁能隙及Z形電源通道結構藉以隔離多層板之雜訊

Combine Partial EBG Structure and Z-shaped power bus for Noise Isolation in Multi-layer PCBs

指導教授 : 林丁丙

摘要


本論文主要研究在高整合、高複雜度的電路設計中,因電流快速切換而產生的接地彈跳雜訊(GBN)。此雜訊會在電源/接地平面傳播且會耦合至上下層鄰近的電源/接地平面,使電路的電源完整性(Power integrity, PI)受到影響。在本文中,主要是利用區段法觀念將矩形平行板分段切割開來,嵌入部份電磁能隙(Partial EBG)結構及Z形電源通道(Z-shape power bus),藉其將電源/接地平面的雜訊隔離。當部份電磁能隙結構及Z形電源通道後被置入平行板後所形成的禁止帶(stop-band)特性已能達到週期性EBG結構一樣的雜訊隔離效果。 透過此建模方法能夠分離出部份EBG及Z形電源通道各自產生的禁止帶及通帶(pass-band)效應。在模型中,平行電路板被分為的5段和不同大小的矩形的電源/接地平面;分別為部份EBG結構透過垂直盲孔連接蘑菇形(Mushroom-like) EBG和矩形共振空腔模型以及由傳輸線路網絡模型描述Z形電源通道,並從模擬及實作結果中驗證從而提出改善方法,有效隔離電源雜訊。

並列摘要


This thesis discusses the ground bounce noise (GBN) in today’s high-integrative and high-complexity circuit designs. GBN not only transmits in its own power/ground plane, but also couples to neighboring power/ground plane. Moreover, in this paper, the main idea is to approximate the use segmentation method and cut off the cavity model of PCB, and with Partial EBG structure and a Z-shape power bus is fitted, whereby the noise power / ground planes isolated. After Partial EBG structure and Z-shape power bus be implantation, stop-band characteristics, noise isolation through the model to achieve some of the period EBG monomer same effect. Through this modeling method capable of separating the stop-band and pass-band and Z-shape affect part of the EBG power generated by each bus. In the model, the PCB is divided into five segments of different sizes and of rectangular power / ground plane; EBG structures are connected as part of a vertical blind hole through the mushroom-shape (Mushroom-like) EBG and rectangular resonant cavity and the transmission line network model to describe the Z-shape power bus. And demonstrate and propose ways to improve and effectively isolated from the power / ground noise simulation and implement results.

參考文獻


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[1] Jong Hwa Kwon, Dong Uk Sim, Sang Il Kwak, and Jong Gwan Yook, “Novel Electromagnetic Bandgap Array Structure on Power Distribution Network for Suppressing,” IEEE Trans. Electromag. Compat., vol. 52, no.2, pp. 365-372, May 2010.
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