以化鎳浸金技術應用於奈米螺旋碳管與CMOS製程的奈米碳管元件

Utilizing Electroless Nickel Immersion Gold Technology in Fabrication of Carbon Nano Coils and Carbon Nanotube Device with CMOS Processes

謝文庭(Wen-Ting Hsieh)

指導教授 ： 黃榮堂 ； 施勝雄

國立臺北科技大學/機電學院/機電整合研究所/碩士(2010年)

摘要

本研究為一使用化鎳浸金製備於奈米螺旋碳管，對CVD方式制備的奈米螺旋碳管進行酸洗、敏化、催化等前處理，在表面增加活性官能基。利用化鎳浸金，以不同參數在奈米螺旋碳管表面施鍍，並且以掃瞄式電子顯微鏡、能量散佈分析儀 、紅外線光譜儀、X光繞射儀，對化鎳浸金各處理步驟，分析施鍍效果。以不同鍍液，測試施鍍後磁性差異，在適當的溫度、PH條件下，成功地在奈米螺旋碳管表面鍍上一層均勻地、明顯螺紋間距、含磷量低的鎳鍍層，之後再包附一層金鍍層。並且以化鎳浸金製備，整合於CMOS製程的奈米碳管電子元件，並討論其製備方法。當CMOS晶片完成製作後，以低溫製備的方式，經乾、溼式蝕刻等後製程，控制電極間隙的二氧化矽層厚度。利用化鎳浸金方式於鋁電極，除了有效的防止鋁基材氧化外，也降低傳輸線訊號的損失、金的高導電性及不易氧化。因此，將以利於之後量測且有效的提高電流，對於整合電路也有很大的助益。並且以自我組裝單分子層、介電泳力，操控奈米碳管沈積並跨接於電極間隙之間，完成奈米碳管電子元件之製作。本文成功地利用化鎳浸金整合於CMOS製程與乾、溼式蝕刻後製程，製作出奈米碳管電子元件。

關鍵字

奈米螺旋碳管 ； CMOS製程 ； 化鎳浸金 ； 介電泳力 ； 自我組裝單分子層

並列摘要

In this study, we utilize electroless nickel immersion gold to fabricate Carbon nano-coils and Carbon nanotube electroncic device combined with standard CMOS process. In this thesis, we will discuss the properties and fabrication of carbon nanotubes electronic devices on a CMOS chips. The Carbon Nano-coils (CNCs) were coated with nickel and gold using electroless plating method. The property of products was observed by Scanning Electron Microscope and Energy Dispersive Spectrometer and X-ray diffraction and Fourier transformed infrared spectroscopy, which shows formation of oxygen containing groups such as OH and COOH. We modified the CNCs by using acid wash and electroless plating, and tested their magnetic property. In the experimental process, the SWCNTs-based carbon nanotube devices microstructures were fabricated by standard CMOS process and wet etching process (post-process), and finally deposited and aligned CNTs on the predefined electrode pairs by print pin to complete SWCNTs-based carbon nanotube devices fabrication.

並列關鍵字

Carbon nano-Coil ； CMOS-MEMS ； Electroless Nickel Immersion Gold ； Dielectrophoresis Force ； Self-Assembled Monolayer (SAM)

參考文獻

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