嵌入式高週波感應加熱模具之研究

Investigation on Induction Heating Mold with Embedded Coil

林柏安(Po-An Lin)

指導教授 ： 黃榮堂 ； 林震

國立臺北科技大學/機電學院/機電整合研究所/碩士(2009年)

摘要

本文利用感應加熱技術對模具快速加熱作研究探討，透過提高模穴表面溫度的方式以改善微結構射出成型時填充過程中因流道淺流動阻力大而造成成型上的困難，利用此技術不但可以解決成型問題、維持產品品質和助於表面微結構的轉寫性，更可以大幅縮短成型週期，因此開發快速加熱、冷卻系統是本研究主要目的。研究中主要利用ANSYS分析軟體來模擬感應線圈對於模板加熱的溫度情形，並配合實驗做驗證。經過模擬和實驗知道高導磁材料具有較佳的感應加熱，可使模具表面溫度迅速上升。而對於施予的電流值、感應線圈的配置和頻率等參數也會影響最後模穴表面溫度。本研究結果顯示實驗與分析都能得到相同的溫度趨勢，利用此模擬方法將可設計更多元多種變化的線圈形式運用於模具身上，以得到各線圈設計在感應加熱中對模具表面控制溫度的效能及可行性。

關鍵字

感應加熱 ； 射出成型 ； 微結構

並列摘要

This thesis researches the mold rapid heating with embedded coil by induction heating technique. Due to the poor flow capability of melting plastics into micro channel, it is difficult to inject the melted plastics into the cavities of the mold. In order to let the injection technique be used in the fabrication of microfluidic chip, raising cavity surface temperature will be one of the solutions. High mold temperature could improve the replication capacity of micro-structures, the problems of injection, the quality of products, and effectively reduces the cycle-time. Therefore, developing systems for rapidly heating and cooling for injection of microfluidic chip is the main objective of this study. We used CAE software-ANSYS to simulation the coil that heating the mold plate as compared with experiment. It is known the high permeability materials could make mold surface rapid heating by simulation and experiment. Coil current, coil to plate distance and frequency etc. could affect the mold surface temperature, too. The capability and accuracy of simulations on the induction heating are verified from experiments, the simulated temperature distributions show reasonable agreement with measured results. We can do complex coil design and use ANSYS software to analysis. To evaluate the feasibility and efficiency of induction heating on the mold surface temperature control.

並列關鍵字

induction heating ； injection molding ； micro-structures

參考文獻

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