以往純金屬與合金靶材通常以熔煉鑄造方式製作,然而鉻銅合金靶材以熔煉方式製造時容易產生成分偏析、微結構不均勻與多孔性等缺陷,即使後續經熱處理或熱加工亦無法將缺陷完全去除。因此,本研究利用粉末冶金之真空燒結(Vacuum Sintering)、熱均壓(HIP)與熱壓(HP)的方式製備鉻銅合金靶材,並藉由進行一系列的實驗測試,以探討不同粉末冶金製程對鉻銅合金靶材性質之影響。 實驗結果顯示,Cr50Cu50與Cr60Cu40真空燒結靶材再經過1050°C 175 MPa 4 hours熱均壓處理後,相對密度分別達到99.42 %與99.69 %,視孔隙率降低至0.54 %與0.30 %,此一結果顯示利用熱均壓處理能有效消除靶材內部封閉孔隙,並獲得高緻密度與高性質之鉻銅合金靶材。 Cr70Cu30真空燒結靶材因本身緻密度不佳,故無法有效利用熱均壓處理使靶材緻密化;而熱壓的結果顯示,以1000°C 60 MPa 1 hour熱壓之Cr70Cu30靶材具有最佳之緻密度(97.62 %)與較低之視孔隙率(0.65 %),此一結果顯示利用熱壓法能有效消除Cr70Cu30靶材內部孔隙,並可使靶材具有較佳之微結構與電性表現。
In past years, pure metal and alloy targets were usually made by melting and casting methods. However, the ingredient segregation, non-uniform microstructure and porosity defects of Cr-Cu alloy targets were frequently produced by melting. Even if the subsequent heat treatment and the hot-working process will not be able completely eliminate. Therefore, we produced the Cr-Cu alloy targets via vacuum sintering, hot isostatic pressing (HIP) and hot pressing (HP) of powder metallurgy in this study. Moreover, we carried out a series of experimental tests to explore the characteristics and effects of different powder metallurgy processes on the Cr-Cu alloy targets. The experimental results show that the relative density of Cr50Cu50 and Cr60Cu40 vacuum sintering targets can reach to 99.42 % and 99.69 %, and apparent porosity decreases to 0.54 % and 0.30 % after 1050°C 175 MPa HIP treatment for 4 h, respectively. It shows that we can obtain the high density and high properties of Cr-Cu alloy targets, and eliminate the closed pores by employing the HIP treatment. Due to the poor density of Cr70Cu30, vacuum sintering targets that will lead to it can not be efficiently produced by HIP treatment. However, the 1000°C 60 MPa 1 h of hot pressing of Cr70Cu30 target achieves the best density (97.62 %) and lower apparent porosity (0.65 %). This result shows that we can effectively eliminate the closed pores of Cr70Cu30 target by way of hot pressing treatment. In addition, we can also produce and make the Cr70Cu30 target with better performance of microstructure and electrical conductivity.