現今筆記型電腦產品朝輕、薄、短小及操作速度愈來愈快的趨勢發展,伴隨著PCB(Printed Circuit Board,印刷電路板)電路訊號的上升時間愈來愈短,高速傳輸與高密度包裝也已成為發展的趨勢,且筆記型電腦裡面的空間相對的擁擠,而針對電磁干擾(EMI)方面,電氣零件會因過度靠近,而使得磁場會互相耦合,造成電磁干擾(EMI)會無法符合國際標準,造成EMI不穩定,其影響出貨品質,所以電磁干擾的問題日益嚴重。 本論文之重點是以INTEL及AMD筆記型電腦印刷電路板進行EMI實際測試,研究3H-Rule、20H-Rule 與Snubber 三種防治EMI方法降低EMI電磁干擾,讓筆記型電腦能夠在測試過程中達到國際法規。進而在印刷電路板設計中提升產品電路性能,以避免使用多餘的壓制電磁干擾的被動元件與機構物件,且兼顧到品質的完整性及成本的減少。
It is obvious that the trend of the notebook in modern life is light, thin and small. With the rise time of PCB circuit signal is getting less and less, the development of high speed transmission and high density package had become a trend. Besides, for that the space in the notebook is too narrow, the electrical components are getting too close among each so that the magnetic fields are coupling among each other. As a result, the EMI is too unstable to not only meet the standard of the international regulation but influence the quality of the notebook. That is, the EMI issue is becoming more and more serious. This study aims to generalize the EMI strategy of 3H-Rule、20H-Rule and Snubber to make the notebook achieves the standard of the international regulation by using an real EMI test on the PCB of the notebook with Intel or AMD platform; thus to enhance the quality of the notebook by decreasing the source of interference of EMI during the PCB design stage to avoid using too much extra negative components and mechanical components which interfere the Electromagnetic interference.