本文主要是建構兩種應用於落地實驗的模型,並探討影響結果的因素與趨勢。首先建立一簡化模型,並由實驗量測值與模型元素邊長收斂使得模擬設定參數合理、正確。進而利用模擬方法,模擬測試物在多種環境下的落地實驗:包含一角三稜六面、不同落地高度、不同外殼肉厚、不同撞擊地面角度、不同加載CCD之位置等,而後再經由田口法找出選定因子中最佳組合參數;接著應用逆向工程方法,以非接觸光學量測系統重建手機外殼原型,導入有限元素軟體分析模擬手機外殼於落地實驗產生衝擊G值大小,得到與前述方法一致的結論,發現測試物在較低的落地高度、有著較厚的外殼、撞擊時與地面所夾角度越小及加載CCD之位置愈靠近對稱中心時,會產生愈小的衝擊G值。
The purpose of this article is to establish two kinds of drop test models for 3C products and to study the influence factors and trends from it. First, through setting a simple model, it makes the simulated input parameter to trend to reasonable and correct by the experienced measurement and the length convergent of model’s elements. Second, by using simulated way, the simulated subject do drop test in many kinds of parameter’s environment which are included with one corner- three edges- six faces, different drop height, different shell thickness, different strike angle of the object to the ground ,different position of Charge Coupled Device and etc. At last, we may find the best combination parameter out via Taguchi method. Further, applying to Reverse Engineering, it can use non-contact optical measurement system to rebuild the prototype of the shell of cellular phone and lead into the software of limited factor to analyze the impact G value occurred by attacking the ground of cellular’s shell. The result same with Reverse Engineering show that it will generate the smallest impact G when test object is on one of the following situation-lower drop height or thicker shell or smaller strike angle to the ground or the position of CCD more near the center symmetry.