材料與加工製程對環氧樹脂半固化預浸膠片性質影響之研究

Study of materials and processing technology and its influence on the properties of epoxy prepregs

謝清文(CHING -WEN HSIH)

指導教授 ： 陳文章

國立臺北科技大學/工程學院/化學工程研究所/碩士(2011年)

摘要

銅箔基板為印刷電路板主要組成之材料，而環氧樹脂半固化片與銅箔經由高溫熱壓可製成銅箔基板，除此之外環氧樹脂半固化片也應用於多層印電路板的黏結材料，銅箔基板曝光蝕刻後成為具有雙面線路之板材，將多片雙面佈有線路的板材利用半固化片黏結成一片板材，使該片板材中具有多層的線路分佈。
本論文主要探討環氧樹脂半固化片品質與特性間的交互影響因素，主要針對材料及加工製作參數條件討論，材料方面從環氧樹脂、填充料、溶劑、添加劑組成的含浸液與玻璃纖維布這些原料品質做探討分析；加工製程方面針對玻璃纖維布及含浸液的塗佈與乾燥做探討分析，找出最合適的材料組合並搭配最適化加工條件。
本實驗結果所得到結論如下，若使用有開纖且搭配浸潤性較佳偶合劑之玻璃纖維布，在加工製程中適用的加工參數範圍較廣，能與較多數材料組合的含浸液做搭配，半固化片產品的外觀缺陷較少、樹脂滲透性也比較好。當材料組合之搭配性較差時可用的加工參數較少，膠片產品的缺陷也較多，因此半固化片的品質變得較不穩定。

關鍵字

銅箔基板 ； 環氧樹脂 ； 玻璃纖維布 ； 浸潤性

並列摘要

Copper clad laminates are major components in the production of printed circuit boards. Both epoxy prepregs and copper foils are used to produce copper clad laminates through the hot compression process. In addition, the epoxy prepregs used as a bonding material for making multi-layer printed circuit boards are laminated together on many sheets of the copper substrates by thermal compression process.
This paper investigates the influence of epoxy prepreg qualities and the interaction of the characteristic factors such as material formulations and manufacturing parameters. For the prepeg formulations of glass fabrics, this paper studied the material parameters of resins, fillers, solvents, and additives. For the manufacturing parameters, the coating of the impregating resins on glass fabrics and the drying of the prepegs were studied. Finally, the most suitable material formulations and the optimal processing conditions were obtained.
The experimental results showed the fiber-opening glass fabrics with an increase in permeability of resins. Using a coupling-agent surface treatment with high wettability on glass fabrics makes it easier for the prepeg manufacturing. Better appearance, fewer defects and more uniform cross-linking structure of the prepregs confirmed the optimal parameters used.

並列關鍵字

Copper clad laminate ； Epoxy resin ； Glass fibers ； wettability

參考文獻

[2] K. Nixdorf, G. Busse,Composites Science and Technology,61,889(2001)

[12] 王榮結, 矽烷偶合劑於玻璃纖維布之耐熱性質研究,逢甲大學紡織工程研究所碩士學位論文 p1-8(2005)

Polymer Degradation and Stability,93,7,103-115(2008)

[29] Jianching Liu, Diing-Guey Hwang, John-Chang Chen, Wen-Jei Yang,

Composites Science and Technology,51,3,359-366(1997)