填充金屬粒子導電膠之塗膜性質研究

Study on Coating Property of Metallic Conductive Adhesives

葉維宗(Wei-Tsung Yeh)

指導教授 ： 芮祥鵬

國立臺北科技大學/工程學院/有機高分子研究所/碩士(2006年)

摘要

填充金屬粒子導電膠之塗膜性質研究實驗是利用丙烯酸酯的黏膠摻混金屬粒子（銅粉、鎳粉、鋁粉），偵測其電阻值，結果發現塗膜厚度與金屬粒徑會影響電阻值的變化，較厚的膜在低濃度（<0.5vol%），因金屬粒子無法與兩銅片達到良好的接觸效果，造成電阻值增大。在塗膜比率（塗膜厚度/粒徑大小）在0.5~0.7之間，其導電效果呈現較佳的狀態。當金屬粒子濃度在3vol%以上時，電阻值會有上升的趨勢，這是因為單位體積膠體的含量不足，造成黏著強度變差，所形成的原因。吾人可從雙平板流變儀（SR-5）與拉伸流變儀（CaBER）上得到印證。
利用環氧樹脂與丙烯酸酯來摻混銅粒子，可由光學顯微上看出，隨著銅粒子的濃度增加，粒子會產生聚集的現象，且銅粒子於環氧樹脂中的分散效果較丙烯酸酯為佳。

關鍵字

導電膠 ； 金屬粒子 ； 抵抗率

並列摘要

Recently, efficient product and lower cost are been required, so that the use of conductive adhesive is more and more important. This experiment blends acrylate with various metallic particles, including aluminum powder, copper powder and nickel powder, to test its resistivity. We can found that coating thickness and metallic particle size would affect the change of resistivity. Because metallic particle can't reach good contact between two copper foils, the thicker film would have higher resistivity in lower concentration( <0.5vol%. ) The resistivity would show a good status when coating ratio that is coating thickness to divide particle size is between 0.5~0.7. When the concentration of metallic particles is over 3vol%, the adhesiveness per unit of glue volume is not enough to stick the two copper boards, the resistivity would therefore get rise. We could get the evidence from SR-5 and CaBER.
It could be found from optical microscope that use epoxy or acrylate to blend with copper powder would make particles agglomerate with increasing of concentration of copper powder. The effect of dispersion on epoxy is better than that on acrylate.

並列關鍵字

conductive adhesive ； metallic particle ； resistivity

參考文獻

【12】顧繼友著,膠接理論與膠接基礎,2003年6月

月,pp.120~132

【5】Jay Janzen, ‘On the critical conductive filler

loading in antistatic composites’, Journal of

【7】J, Liu, ‘Conductive Adhesive for Electronics