近年來電子元件整合技術提升,伴隨高功率所帶來的廢熱,常使電子元件熱當或損毀,因此扮演著散熱角色的導熱膏(Thermal Grease;TG)廣泛被應用,目前常見的導熱膏使用氮化硼、氧化鋅、氧化鋁、氮化鋁、碳化矽等填充材料,大多使用單一粉體且導熱值約在1 W/mK,在反覆的使用容易產生相分離等現象。 本研究採用自製碳管經由羧化後與偶合劑鍵結,以矽油當基材填充氮化鋁、氮化硼、改質碳管,經由混煉法製成複合粉體導熱膏。探討不同導熱填充材料、粒徑尺寸與固含量,對於導熱複合材料熱傳導效能及其他物性之影響。研究結果發現,填充材料的種類與填充比例皆會改變複材熱傳導係數;添加40 Vol. %氮化硼、氮化鋁,熱傳導係數為 0.84 W/mK與0.91 W/mK,在相同填充比例下,添加改質碳管的複合材料導熱值最高可達1.821 W/mK,且熱重損失低於0.17 Wt.%以下,經由50次的冷熱衝擊後,依然有良好的再現性,若能將此種複合材料應用於散熱相關區域,應能明顯降低電子元件的工作溫度。
Integrate technology to enhance the electronic components in recent years. With high-power brought about by the heat. Often so hot when or damage electronic components. Therefore, Thermal grease is widely applied. Now common use of BN,ZnO,Al2O3,AlN,SiC,and other fill materials. Most of the powder and the thermal conductivity using a single value of about 1W/mK. Prone to repeated use in the next phase separation phenomena. In this study, Carbon nanotubes made by the carboxylation afterSilane coupling agent bonding. When the substrate with silicone oil filled AlN,BN, modified carbon nanotubes. Composite powder by mixing the legal system into a thermal grease. Thermal conductivity of different filling materials. Grain size and solid content. Thermal conductivity of composite materials for thermalefficiency and the otherness of the impact.The results showed that the type of filling material will change boththe fill ratio of composite thermal conductivity. Add 40 Vol.% BN, AlN. Thermal conductivity of 0.84 W / mK and0.91 W / mK. In the same proportion under Tianchong addmodification of composite carbon nanotube thermal conductivityvalues up to 1.821 W / mK. And thermal heavy loss is less than0.17 Wt. % or less. By 50 hot and cold attacks. There is still a goodreproducibility. If this kinds of composite aterials used in heat-related areas. Should be able to significantly reduce the operating temperature of electronic components.