丙烯酸系感壓膠黏性與熱性質之研究

The Study of Adhesive and Thermal Properties of An Acrylic Pressure Sensitive Adhesive

黃琮賀(C.H. Wong)

指導教授 ： 周文祥

國立臺北科技大學/機電學院/機電整合研究所/碩士(2013年)

https://doi.org/10.6841/NTUT.2013.00079

摘要

電子產品因功能增加使得所需的功率也相對提高，而導致電子元件的溫度過高，使元件因損壞而喪失效能，市面上的導熱膠帶導熱值約為1.0 W/mK，故此將藉由偶合劑或分散劑改質複合導熱粉體，以超越熱傳導係數1.0 W/mK為目標。
　　本研究採用一種內含主成份為2-乙基丙烯酸辛酯、丙烯酸丁酯、醋酸乙烯酸等單體的丙烯酸系感壓膠為主體進行此研究。實驗中將比較添加多異氰酸酯、三聚氰胺與過氧化二異丙苯架橋劑之對耐熱性質的表現，並使用自製的增黏劑提升丙烯酸酯感壓膠之黏接力，以補償導熱粉體加入後所降低之黏著力，最後再填充氮化鋁與氧化鋁導熱粉體並經由混鍊法製成導熱膠帶。
研究結果顯示，經PEG-40偶合劑改質之氮化鋁與氧化鋁(8:2)之比例填充至55wt.%時，可得導熱值1.55 W/mK且黏著力1690 gf、初黏力1520 gf與保持力大於72小時之高導熱高黏著力之陶瓷粉體導熱膠帶，熱重損失為0.8 %，已可媲美市售導熱膠帶導熱值0.8-1 W/mK、黏著力1300-1800 gf與熱重損失在1%以內之規格。其導熱膠帶在反覆冷熱衝擊實驗下，導熱值下降5 -7 %，且並未造成表面劣化或產生發泡現象。

關鍵字

熱傳導 ； 導熱膠帶 ； 耐熱

並列摘要

To increase the more function of electrical products, the more power is required. It makes the thermal shutdown of electrical products. This research featuring the self-made thermal tape. Modified the thermal powder by the coupling agent ordispersing agent, which thermal conductivity is better than commercial products (1.0 w/mk).
　　The synthesis of this study is to use a kind of acrylic Pressure Sensitive Adhesive (PSA),which is by using 2-Ethylhexyl acrylate、Butyl Acrylate and Polyvinyl acetate as monomers, in this experiment, we compared the difference ofpolyisocyanate、melamine and dicumyl peroxide crosslinker. To compensate the lowadhesion, use of self-made thickener. The mixture is filled of AlN and Al2O3 thermal powderto fabricate thermal tape.

　　In this reaserch, the solid loading 55wt.% of AlN andAl2O3 which hadcoated by peg40. It’sthermal conductivity is 1.55w/mk. The adhesion is 1690gf, tack is 1520 gf and the cohesion can hold for 72 hours, thermal weight loss of 0.8%. It’s performance is good enough to compete with the commercial product. The thermal conductivity of commercial product is 0.8-1 w/mk. The adhesion is 1300-1800 gf.Thermal weight loss of 1%.
　　The thermal tape through 50 hot and cold shock thermal conductivity decrease of approximately 5-7 %, and surface is intact and not foundbubbles.

並列關鍵字

thermal conductivity ； thermal tape ； Resistanceheat

參考文獻

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